New SMT Equipment: bare bake (1)

Surface Mount Device Tape and Reel Service

Surface Mount Device Tape and Reel Service

New Equipment | Tape and Reel Services

Syagrus Systems specializes in high mix low volume surface mount device (SMD) tape and reel packaging to support component distributors and OEM's. We offer the highest quality SMD tape and reel services available, and at lower costs than most compani

Syagrus Systems

Electronics Forum: bare bake (81)

Do yo have to bake unused bare boards or just Vacuum Pack?

Electronics Forum | Wed Aug 23 11:56:09 EDT 2006 | aj

rgd's aj...

Do yo have to bake unused bare boards or just Vacuum Pack?

Electronics Forum | Fri Aug 25 07:42:29 EDT 2006 | davef

Our sympathies about the ENIG boards. B:) So, you cut the end off the barrier bag, take 200 boards, heat seal the end of the bag and restock it, build the 200 boards and ship them, right?

Used SMT Equipment: bare bake (3)



Used SMT Equipment | Soldering - Reflow

MULTIPLE VITRONICS REFLOW OVENS AVAILABLE WWW.XLINEASSETS.COM - AUCTION ITEMS JABIL LIQUIDATION Featured Equipment: St. Petersburg, FL Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18

X-Line Asset Management

Fuji CP 642 and CP65

Fuji CP 642 and CP65

Used SMT Equipment | Pick and Place/Feeders

Multiple Fuji CP Chipshooters Available.   AUCTION ITEMS Jabil Liquidation Including Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18 Rework System Flexlink Transfer C

X-Line Asset Management

Industry News: bare bake (5)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

SMART Group to Host Moisture-Sensitive Components/PCB Handling Workshop

Industry News | 2011-12-30 23:20:54.0

SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will host a workshop titled Handling Moisture-Sensitive Components & PCBs Without Failure on Wednesday, January 25, 2012 at the Stoke Mandeville Stadium in Aylesbury, Buckinghamshire, UK.

The SMART Group

Technical Library: bare bake (27)

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.


Non-Destructive Test Methods

Technical Library | 2019-09-23 09:35:00.0

Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).

ACI Technologies, Inc.

Express Newsletter: bare bake (91)

Partner Websites: bare bake (3)

PCB Manufacturing Process


.  The basic manufacturing process for a single panel is as follows: Foil Sheet-->Unloading-->Bake Plate (Preventing Deformation)-->Molding-->Washing, Drying-->Foil (or Screen Printing)->Exposure Development

Ask Questions - EPTAC


? In other words when the insulation is installed on the wire and then it is soldered to a terminal. Read Answer Ceramic CCA’s and Aqueous Wash and Bake Out Prior to Parylene Coating Question

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Software for SMT placement & AOI - Free Download.

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World's Best Reflow Oven Customizable for Unique Applications
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