Industry News: barrel to barrel spacing (Page 1 of 3)

Compact Reference Manuals to IPC-A-610E and IPC J-STD-001 Illustrate Acceptance Criteria in a Handy Format for Inspectors and Operators

Industry News | 2010-09-30 00:35:51.0

The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.

Association Connecting Electronics Industries (IPC)

IPC Releases Revision A to IPC-2222 Design Standard

Industry News | 2010-12-17 01:47:04.0

IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

Association Connecting Electronics Industries (IPC)

Nordson EFD Introduces Unity HiTemp Disposable Syringe Barrels that Withstand up to 180° C for Eight Hours

Industry News | 2015-12-02 17:52:02.0

Nordson EFD introduces Unity™ HiTemp™ syringe barrels. These disposable 30cc barrels reduce the downtime and maintenance costs often associated with aluminum barrels commonly used in the pneumatic dispensing of hot melt adhesives.

Nordson EFD

Techcon Systems to Showcase New Generation Fluid Dispensing Solutions at Productronica

Industry News | 2009-12-07 19:48:02.0

Techcon Systems invites visitors to Productronica 2009 to ‘TAP’ into Techcon Systems ‘Training’, ‘Application’ and ‘Productivity’ advantages with an impressive line up of the latest cost-saving fluid dispensing solutions. A leading global supplier of fluid dispensing systems and accessories, Techcon Systems will exhibit alongside Metcal and Oki branded products on the OK International Stand 127, Hall A4 at the bi-annual event, which is scheduled to take place 10th – 13th November at the New Munich Trade Fair Center in Munich, Germany. German companies will also be able to discuss Techcon Systems products at the show with German partner Globaco.

Techcon Systems

Techcon Systems Adds Easy Flow Blue Pistons to the 700 Series Product Line

Industry News | 2009-05-29 10:21:44.0

Garden Grove, CA � May 2009 � Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce the addition of the new Easy Flow Blue Piston to the 700 Series Premier Dispensing Product Line.

Techcon Systems

Techcon Announces Product Update to Manual Syringe Assembly

Industry News | 2016-01-05 18:12:09.0

Techcon Systems today announced the availability of the new 1ml manual syringe assembly, MSA401L-1.

Techcon Systems

Techcon Systems to Exhibit Precision Valves at the 2012 IPC APEX Expo

Industry News | 2012-01-21 17:07:26.0

Techcon Systems will showcase its precision valves in Booth #1641 at the upcoming IPC APEX Expo.

Techcon Systems

Multitest’s Tony DeRosa to Present at BiTS 2010

Industry News | 2010-02-17 20:27:31.0

Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Tony DeRosa, product manager, will present a paper titled “New Probe Architecture Performance in High-Volume Production” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.

Multitest Elektronische Systeme GmbH

Techcon Systems to Demonstrate New TS9000 Series Jet Tech Valve at NEPCON China 2013

Industry News | 2013-03-25 15:44:52.0

Techcon Systems, will exhibit in booth 1E41 NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

Techcon Systems

New PEM SMTSK Standoff Fasteners for Printed Circuit Board Applications

Industry News | 2019-02-26 09:16:08.0

New PEM® SMTSK™ unthreaded standoffs from PennEngineering® permanently surface mount on printed circuit boards to enable quick attachment and removal of stacked components without requiring screws or tools. Their unique barrel design allows for a stacked board or panel to be slipped easily into place and then detached by simply sliding the component sideways and lifting it off. These standoffs will effectively serve to attach and

PennEngineering

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