Industry News: baseplate (Page 1 of 1)

SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

Industry News | 2018-04-22 19:12:45.0

SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Saelig Introduces the PCBite System For Precise PCB Probing

Industry News | 2019-06-19 15:27:00.0

This kit holds any size circuit board and features spring-loaded fine tips on stable gooseneck arms for hands-free PCB probing

Saelig Co. Inc.

IMS Releases Compact Thick Film 7GHz SMT Wilkinson Power Divider

Industry News | 2013-05-23 21:38:41.0

International Manufacturing Services, Inc. (IMS) announces the availability of its compact Thick Film 7GHz SMT Wilkinson Power Divider.

International Manufacturing Services (IMS)

Indium Corporation Features InFORMS® at NEPCON Japan

Industry News | 2015-12-13 19:42:23.0

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.

Indium Corporation

Indium Corporation Announces SMTA South China Presentations

Industry News | 2021-08-13 08:33:52.0

Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the Shenzhen Convention & Exhibition Center.

Indium Corporation

Indium Corporation Features New InFORMS® Solution for Die-Level Bonding at PCIM 2019

Industry News | 2019-04-15 06:39:46.0

Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.

Indium Corporation

MacDermid Alpha to Present Power Package Attach by Silver Sinteringat PCIM Asia Conference in Shanghai

Industry News | 2020-11-06 17:27:12.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Power Package Attach by Silver Sintering – Process, Performance & Reliability" at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.

MacDermid Alpha Electronics Solutions

Indium Corporation Expert to Host Power Electronics Webinar

Industry News | 2020-06-18 14:22:04.0

Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.

Indium Corporation

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