Technical Library: beam and works (Page 1 of 4)

Effortless LED Lens Assembly: Explore Our Pick and Place Machine

Technical Library | 2023-09-16 07:10:47.0

LED high speed pick and place machines are a complex and specialized piece of equipment. In this quick guide, we will cover the basics of how these machines work, as well as some of the factors to consider when choosing one.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications

Technical Library | 2013-11-27 16:54:01.0

The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing, with a significantly growing number of amplitude / phase control points (number of beams * numbers of radiating elements). As a consequence, the RF component’s package topology is evolving (larger number of I/Os, interconnections densification ...) which directly affect the routing and architecture of the multilayer boards they are mounted on. It then becomes necessary to improve the density of these boards (...) This paper will present the work performed to achieve LCP-based high density multilayer structures, describing the different electrical and technological breadboards manufactured and tested and presenting the results obtained.

THALES

Whisker Growth In Tin Alloys On Glass-Epoxy Laminate Studied By Scanning ION Microscopy and Energy-Dispersive X-Ray Spectroscopy

Technical Library | 2013-08-22 14:28:58.0

Tin-rich solders are widely applied in the electronic industry in the majority of modern printed circuit boards (PCBs). Because the use of lead-tin solders has been banned in the European Union since 2006, the problem of the bridging of adjacent conductors due to tin whisker growth (limited before by the addition of Pb) has been reborn. In this study tin alloys soldered on glass-epoxy laminate (typically used for PCBs) are considered. Scanning ion microscopy with Focused Ion Beam (FIB) system and energy-dispersive X-ray spectroscopy (EDXS) were used to determine correlations between spatial non-uniformities of the glass-epoxy laminate, the distribution of intermetallic compounds and whisker growth.

The Institute of Electron Technology (ITE)

Paper Substrates and Inks for Printed Electronics

Technical Library | 2023-03-13 19:40:21.0

The present work explores the effects of paper properties on conventional silver-based conducting inks. The effects of smoothness, relative humidity, porosity, permeability and wettability on electrical properties of silver inks on different paper substrates were studied. Another objective of this work was to prepare and study polyaniline synthesized in the presence of different lignosulfonates.

Western Michigan University

The CAMM2 Journey and Future Potential

Technical Library | 2024-07-30 19:18:15.0

The CAMM2 Journey and Future Potential • A short history of the CAMM2 journey since 2020 • Details on LPDDR5 CAMM2 and DDR5 CAMM2 • The future work and potential of CAMM2

JEDEC Solid State Technology Association

Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven

Technical Library | 2017-12-21 11:24:05.0

The present work concerns on the use of sensors to monitor the structural health of wind turbine . Conventionally the inspection was made using non-contact sensing during the turbine’s inoperable period hence loss occurred. A real -time monitoring system via embedded wireless sensor is preferred but the sensor could only be implanted using non-contact printing method due to most turbine blade s’ curved surface. Conductive ink associate d with non-contact printing method via fluid dispensing system are proposed since conductive inks are proven stretchable and fluid dispensing system enables printing on various substrates and works well with any materials...

University of Tun Hussein Onn

Package-on-Package (PoP) Warpage Characteristic and Requirement

Technical Library | 2021-12-16 01:48:41.0

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.

Intel Corporation

Inline Quality Control and Position Detection in Dispensing Systems

Technical Library | 2024-02-06 14:36:04.0

Quality monitoring for verifiable, high-precision application of adhesives and sealants now begins with detecting the position of the component. Dispensing systems are in continuous use and have to work with 100 percent accuracy. And this level of accuracy must be verifiable. Demands on electronic components continue to escalate as these components also need to operate continuously and flawlessly, especially in the automotive and medical sectors. At the same time, there is increasing pressure to automate as companies are looking to achieve the shortest possible cycle times and maximum output.

Scheugenpflug Inc.

Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems

Technical Library | 2012-04-05 22:53:10.0

In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob

Georgia Institute of Technology

101 EMI Shielding Tips and Tricks

Technical Library | 2020-07-02 13:16:32.0

Principle of shielding 1 The principle of shielding is creating a conductive layer completely surrounding the object you want to shield. This was invented by Michael Faraday and this system is known as a Faraday Cage. 2 Ideally, the shielding layer will be made up of conductive sheets or layers of metal that are connected by means of welding or soldering, without any interruptions. The shielding is perfect when there is no difference in conductivity between the used materials. When dealing with frequencies below 30 MHz, the metal thickness affects shielding effectiveness. We also offer a range of shielding methods for plastic enclosures. A complete absence of interruptions is not a realistic goal since the Faraday cage will have to be opened from time to time so electronics, equipment or people can be moved in or out. Openings are also needed for displays, ventilation, cooling, power supply, signals etc. 3 Shielding works in both directions, items inside the shielded room are shielded from outside influences. (Fig. 3.1)

Holland Shielding Systems BV

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