Industry Directory | Consultant / Service Provider / Manufacturer
A Top-25 global EMS provider headquartered in Burnaby, BC, Canada
Now for nearly a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints with the patented ERSASCOPE technology. Industry experts including IPC recognize the critical importance of using ERSASCOPE technology
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Sat Sep 25 10:36:06 EDT 2004 | gpaelmo
Hi, Anyone using this in production? Our company is looking into this model (used). Board size up to to 8"x10", max layer=12, single and double side SMT, medium density mostly passives, max QFP/BGA on board=7-10, 1,000-3,000 boards/wk. Can anyone d
Electronics Forum | Fri Jun 05 19:20:25 EDT 1998 | Rin
| Our company is currently looking to implement a SMT production line. What I am looking for is feedback on people's experiences with various machines. | Here's what we are in the market for: | Low/Mid volume 3,000+cph machine that can handle high j
Used SMT Equipment | X-Ray Inspection
This is a used NXR-1525 Xray System can be used to for PCB X-ray inspection of BGA and other SMD Devices. It is a high resolution X-ray system that can show inner layer traces of the Circuit Board. The date of manufacture is September 1999. It
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2011-10-03 15:19:17.0
IPC invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit paper abstracts for IPC’s International Academic Paper Competition.
The ERSASCOPE systems provide unique, optical inspection of solder joints. The patented systems ideally complement x-ray inspection of BGAs! Find our products ? https://www.kurtzersa.com/electronics-production-equipment/rework-inspection-systems/insp
(Flex) BGA Using a Polyimide Tape Substrate Trent
| https://www.feedersupplier.com/sale-13119501-fuji-bga-rework-station-pcb-loader-unloader-parts.html
FUJI BGA Rework Station PCB Loader Unloader parts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11658513-heller-1809mkiii-1913mkiii-board-t-c-digitizer-module-tdm-heller-insustries.html
HELLER 1809MKIII 1913MKIII Board T/C Digitizer Module TDM Heller Insustries Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
winsouce.jpg)