473 bga 3000 results

SMTnet Express July 11 - 2013, Subscribers: 26149

SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute

The Call for Halogen-Free Electronic Assemblies

Void Detection in Large Solder Joints of Integrated Power Electronics

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMT Manufacturability and Reliability in PCB Cavities

SMTnet Express - November 19, 2015

SMTnet Express - March 22, 2018

Implementation challenges for PCB tracking using RFID

Implementation challenges for PCB tracking using RFID

Productronica 2007 Special Show Report