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. Analysis of the thermal cycle results revealed that there was no statistically significant difference between the void and void-less solder joint populations for the 144 I/O BGA components (Figure 4). Figure 4
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. Analysis of the thermal cycle results revealed that there was no statistically significant difference between the void and void-less solder joint populations for the 144 I/O BGA components (Figure 4). Figure 4
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: Conformal Coating Module 4: Thru-Hole Components Rework Module 5: Chip and MELF Rework Module 6: SOIC , SOT, and Gull Wing Rework Module 7
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/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical, and environmental requirements
