| http://etasmt.com:9060/te_news_bulletin/2020-05-04/15961.chtml
. If there is a BGA, the peak temperature should be set within 240 to 260 degrees and maintained for about 40 seconds. In addition, it should be noted that in the reflow area, the reflow soldering time should not be too long, so as not to cause damage to the furnace, or cause the PCB board to be scorched or the component malfunctions
| http://www.szhonreal.com/productview.asp?id=40
. Made of quality heating material;desoldering and solding procedures of BGA are precisely controlled; 2. Movable heating head,which can be moved freely horizontally
| http://www.szhonreal.com/productview.asp?id=41
. Top heating system and cooling system are designed 2 in 1,(which is our patent design), temperature controlled accurately and evenly
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/srt-training-calibration-and-certification
. Machine Operation and Profile Development. Circuit board preparation - masking, baking and other process steps. BGA site preparation
| https://www.eptac.com/soldertip/soldertips-printed-circuit-board-bow-and-twist-showing-up/
. Next, from an equipment perspective, check the equipment venting to make sure the air flow has not changed, which would impact oven temperature
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-printed-circuit-board-bow-and-twist-showing-up
. Next, from an equipment perspective, check the equipment venting to make sure the air flow has not changed, which would impact oven temperature
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Doing this requires an understanding of the conditions by which reflow can go wrong. By gaining this insight, one can greatly improve the quality of products manufactured
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
) The migration of base metal into a solder alloy through the process of dissolution. Liquidus Temperature Temperature above which a non-eutectic alloy is completely liquid