Industry Directory: bga balling (32)

BGA Bumps

Industry Directory | Manufacturer of Components

Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale

SMT Solutions

Industry Directory |

Salvage of BGA (Re-balling), Tape and Reel Services , PCB Repair

New SMT Equipment: bga balling (767)

Automatic solder paste printing machine

Automatic solder paste printing machine

New Equipment | Board Handling - Storage

Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T

KingFei SMT Tech

Semi automatic solder paste printer S400

Semi automatic solder paste printer S400

New Equipment | Assembly Services

Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota

KingFei SMT Tech

Electronics Forum: bga balling (1397)

Re balling BGA

Electronics Forum | Fri May 22 16:14:45 EDT 1998 | Earl Moon

I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). Earl Moon

Re: Re balling BGA

Electronics Forum | Sun May 31 16:00:33 EDT 1998 | Eric

Earl, I am not sure of your specifc application but we have a good system to easily reball your BGA's E-mail me at bgakit@concentric.net for more information. Thanks, Eric

Used SMT Equipment: bga balling (36)

Samsung Supply of SAMSUNG Samsung Tablet CP63/CP40/SM321 / CP45FV/SM421 / Price concessions

Samsung Supply of SAMSUNG Samsung Tablet CP63/CP40/SM321 / CP45FV/SM421 / Price concessions

Used SMT Equipment | Pick and Place/Feeders

SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee

KingFei SMT Tech

Yamaha YV100XGP

Yamaha YV100XGP

Used SMT Equipment | Pick and Place/Feeders

Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high

Qinyi Electronics Co.,Ltd

Industry News: bga balling (237)

Seika Machinery Introduces PR1 Pocket Handy BGA Solder Ball Checker

Industry News | 2010-05-29 18:01:49.0

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections.

Seika Machinery, Inc.

Seika Machinery, Inc. Features the HIROX MX-BGAZ II Lens

Industry News | 2009-06-29 07:18:50.0

TORRANCE, CA — June 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it now carries HIROX’s MX-BGAZ II Lens for easy and accurate BGA exterior observation.

Seika Machinery, Inc.

Parts & Supplies: bga balling (203)

Juki ORIGINAL Juki Spare Parts JUKI 40047512 FX-3 OCC C LIGHT PCB ASM

Juki ORIGINAL Juki Spare Parts JUKI 40047512 FX-3 OCC C LIGHT PCB ASM

Parts & Supplies | SMT Equipment

ORIGINAL SMT MACHINE SPARE PARTS JUKI 40047512 FX-3 OCC C LIGHT PCB ASM JUKI Nozzle Specifications: Brand Name JUKI OCC C LIGHT PCB Part Number 40047512 Model Number Ensure Tested buy juki Guarantee 1 month usage for machine FX-3 FX-3R

KingFei SMT Tech

Juki L140E321000 SMT Spare Parts Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment

Juki L140E321000 SMT Spare Parts Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment

Parts & Supplies | Component Packaging

L140E321000 Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment JUKI E2047700000 CT BELT F JUKI E2047721000 DRIVE PULLEY F JUKI E2047725000 RAIL PLATE FL JUKI E2048700000 CT BELT R JUKI E2048721000 DRIVE PULLEY R JUKI E2048725000 RAIL PLATE F

KingFei SMT Tech

Technical Library: bga balling (34)

Investigation of PCB Failure after SMT Manufacturing Process

Technical Library | 2019-10-21 09:58:50.0

An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).

ACI Technologies, Inc.

BGA Placement on Rework Station

Technical Library | 2019-06-12 10:33:58.0

The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.

ACI Technologies, Inc.

Videos: bga balling (37)

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Videos

Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework

Precision PCB Services, Inc

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Training Courses: bga balling (13)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga balling (5)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Ball Grid Array Rework - How to Do It Successfully

Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,

Ball Grid Array Rework - How to Do It Successfully

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga balling (4)

Advanced Manufacturing Technology Engineer

Career Center | Space Coast, Florida USA | Engineering,Research and Development

Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit

Priority Search

Design for Test (DFT) / ATE Test Background

Career Center | San Jose, California USA | Engineering,Research and Development

www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som

SRQ Consultants LLC

Career Center - Resumes: bga balling (6)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

Express Newsletter: bga balling (492)

Reliability of BGA Solder Joints after Re-Balling Process

Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO

Partner Websites: bga balling (83)

Mini Micro Stencil BGA Re-Balling Station_ID 140207: World Equipment Source

| https://www.wesource.com/rework-systems-and-accessories/mini-micro-stencil-bga-re-balling-station-id-140207/

Mini Micro Stencil BGA Re-Balling Station_ID 140207: World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159   CALL US

BGA Rework Training and Certification – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training

. BGA Re-Balling BGA pad Repair Flux Considerations for BGA's, LGA's and QFN's. Solder Paste Considerations for Fine Pitch Devices

Precision PCB Services, Inc


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