Industry Directory: bga balls (32)

BGA Bumps

Industry Directory | Manufacturer of Components

Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale

SMT Solutions

Industry Directory |

Salvage of BGA (Re-balling), Tape and Reel Services , PCB Repair

New SMT Equipment: bga balls (765)

DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet

New Equipment | Dispensing

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi

Nordson ASYMTEK

Automatic solder paste printing machine

Automatic solder paste printing machine

New Equipment | Board Handling - Storage

Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T

KingFei SMT Tech

Electronics Forum: bga balls (1397)

mirco bga stencil opening

Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton

We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac

bga placement w/Fuji IP2?

Electronics Forum | Tue Jul 13 00:40:44 EDT 2004 | Darren

Yes of course we are doing placement of BGA's with an IPII. However there is no front lighting so you can not inspect the balls. If the silhouette is square enough there is no problem with alignment. Just use the largest nozzle that will fit on the p

Used SMT Equipment: bga balls (37)

Samsung Supply of SAMSUNG Samsung Tablet CP63/CP40/SM321 / CP45FV/SM421 / Price concessions

Samsung Supply of SAMSUNG Samsung Tablet CP63/CP40/SM321 / CP45FV/SM421 / Price concessions

Used SMT Equipment | Pick and Place/Feeders

SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee

KingFei SMT Tech

Yamaha YV100XGP

Yamaha YV100XGP

Used SMT Equipment | Pick and Place/Feeders

Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high

Qinyi Electronics Co.,Ltd

Industry News: bga balls (237)

Seika Machinery Introduces PR1 Pocket Handy BGA Solder Ball Checker

Industry News | 2010-05-29 18:01:49.0

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections.

Seika Machinery, Inc.

Seika Machinery, Inc. Features the HIROX MX-BGAZ II Lens

Industry News | 2009-06-29 07:18:50.0

TORRANCE, CA — June 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it now carries HIROX’s MX-BGAZ II Lens for easy and accurate BGA exterior observation.

Seika Machinery, Inc.

Parts & Supplies: bga balls (203)

Juki ORIGINAL Juki Spare Parts JUKI 40047512 FX-3 OCC C LIGHT PCB ASM

Juki ORIGINAL Juki Spare Parts JUKI 40047512 FX-3 OCC C LIGHT PCB ASM

Parts & Supplies | SMT Equipment

ORIGINAL SMT MACHINE SPARE PARTS JUKI 40047512 FX-3 OCC C LIGHT PCB ASM JUKI Nozzle Specifications: Brand Name JUKI OCC C LIGHT PCB Part Number 40047512 Model Number Ensure Tested buy juki Guarantee 1 month usage for machine FX-3 FX-3R

KingFei SMT Tech

Juki L140E321000 SMT Spare Parts Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment

Juki L140E321000 SMT Spare Parts Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment

Parts & Supplies | Component Packaging

L140E321000 Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment JUKI E2047700000 CT BELT F JUKI E2047721000 DRIVE PULLEY F JUKI E2047725000 RAIL PLATE FL JUKI E2048700000 CT BELT R JUKI E2048721000 DRIVE PULLEY R JUKI E2048725000 RAIL PLATE F

KingFei SMT Tech

Technical Library: bga balls (34)

Investigation of PCB Failure after SMT Manufacturing Process

Technical Library | 2019-10-21 09:58:50.0

An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).

ACI Technologies, Inc.

BGA Placement on Rework Station

Technical Library | 2019-06-12 10:33:58.0

The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.

ACI Technologies, Inc.

Videos: bga balls (36)

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

Nordson ASYMTEK

Hirox RH-2000 - next generation digital microscopy

Hirox RH-2000 - next generation digital microscopy

Videos

Discover the RH-2000 from Hirox! More information: - www.hirox-europe.com - www.hirox.com - www.hirox-usa.com

Seika Machinery, Inc.

Training Courses: bga balls (13)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga balls (16)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Ball Grid Array Rework - How to Do It Successfully

Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,

Ball Grid Array Rework - How to Do It Successfully

Surface Mount Technology Association (SMTA)

Career Center - Resumes: bga balls (6)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

Express Newsletter: bga balls (475)

Reliability of BGA Solder Joints after Re-Balling Process

Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO

Partner Websites: bga balls (249)

Solder Balls – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/solder-balls

. Home Catalog Blog About us Home › Solder Balls Solder Balls Browse by All BGA Balls BGA Reballing Lead Free REballing ROHS Solder Balls Sort by Featured Best Selling Alphabetically, A-Z Alphabetically, Z-A Price, low to high Price

Precision PCB Services, Inc

BGA Cleaning After Balling - BGA / CMO

ZESTRON Americas | https://www.zestron.com/cleaning-applications/power-electronics-packages/bga-cleaning.html

BGA Cleaning After Balling - BGA / CMO Contact us log in english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 繁體中文 日本語 한국어 русский

ZESTRON Americas


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