Electronics Forum | Wed Jul 01 04:54:28 EDT 2015 | jvercamm
hi, the last post on pad cratering dates from 2012. We have (likely similar) problems with a RoHS 783 solder ball BGA size 29x29mm^2 (organic package BT), pitch is 1mm and solder ball diam is 0.5mm the field failure is after 12 months, almost exclu
Electronics Forum | Mon Jul 23 14:39:11 EDT 2012 | hegemon
I would think that wave solder beneath a BGA component might be a little bit stressful. The board will be expanding much faster than the BGA on the topside. This will cause some stress to the solder joints that might show up as the failure you are
Electronics Forum | Mon Jul 23 05:40:58 EDT 2012 | franks
We are having a problem with a 601 pin BGA in that the corners of the BGA are lifting and taking the pads with them. Faults are not always seen straight away so we are not sure at which point the fault is happening. So far it looks as though flexing
Electronics Forum | Fri Jun 05 17:36:39 EDT 2009 | gsala
what do you think about Moisture entrapped into BGA or PCB before reflow ? regards GSx
Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289
This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i
Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef
IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as
Electronics Forum | Sat Jun 06 15:11:17 EDT 2009 | ysutariya
Was this a lead-free capable material that fits into IPC 4101/126 or /129, like an Isola 370HR? I would not be surprised because from the picture I think I can see resin underneath the lifted copper, which is an interlaminate separate. This is a
Electronics Forum | Thu Sep 25 16:50:50 EDT 2008 | glennster
Ditto here, also. This is generally referred to as �cratering,� and is associated with stress on boards from operations such as ICT, installation of compliant pin connectors, and depanelization. It is more common on PCBs designed for Lead-free proc
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