Industry Directory: bga exposed pad (12)

InnerStep

Industry Directory | Manufacturer

pcb construction@testing using surface mount and through hole components.

USA STENCILS , INC.

Industry Directory | Consultant / Service Provider / Manufacturer

Manufacturing SMT Stencil, Reballing stencil. SMT pallet; Wave solder pallet and Engineering Services

New SMT Equipment: bga exposed pad (194)

3D SPI-7500 solder paste thickness gauge

3D SPI-7500 solder paste thickness gauge

New Equipment | Assembly Services

Detailed introduction of 3D spi-7500 solder paste thickness gauge  Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc

KingFei SMT Tech

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

Electronics Forum: bga exposed pad (1218)

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 10:36:05 EDT 2008 | davef

Yes, it's peculiar that the layout of this board is so disorganized * Pads are not round, uniform, or the same size * Exposed traces have different thickness

cost effective bga remove

Electronics Forum | Wed Mar 17 14:59:53 EST 2004 | Claude_Couture

since there is a bit of humor in this thread, try drilling the pads from the opposite side of the pcb.

Used SMT Equipment: bga exposed pad (5)

Manncorp BR790-HD BGA Rework Station

Manncorp BR790-HD BGA Rework Station

Used SMT Equipment | Repair/Rework

♣ IN-Like New Condition, Only Used Twice ♣ ◘ Split-Vision Optics with 1.3 Million Pixel HD Video Camera, Electronic Zoom Adjustment, and LED Lighting, Projects Superimposed Images of Component Leads and PCB Pads on 15" Full Color LCD Display.

World Equipment Source / R1 Source, Inc.

Torch TP400V

Torch TP400V

Used SMT Equipment | Pick and Place/Feeders

Automatic pick and place machine TP400V is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0603、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision

Beijing Torch Co.,Ltd

Industry News: bga exposed pad (136)

Stencils Optimise Paste Release

Industry News | 2003-03-21 08:12:24.0

Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.

SMTnet

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Industry News | 2018-04-18 18:06:14.0

SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Parts & Supplies: bga exposed pad (229)

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0

Parts & Supplies | SMT Equipment

SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0 Specifications: Brand Name JUKI IMG-P IMAGE BOARD Part number E86107210A0 Model IMG-P Ensure Test in machine confirmation Guarantee 3 month u

KingFei SMT Tech

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 MATCHING PWB ASM E86317210A0

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 MATCHING PWB ASM E86317210A0

Parts & Supplies | SMT Equipment

SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 MATCHING PWB ASM E86317210A0 Specifications: Brand Name JUKI MATCHING PWB Part number E86317210A0 Model MATCHING PWB Ensure Test in machine confirmation Guarantee 3 month

KingFei SMT Tech

Technical Library: bga exposed pad (10)

Pad Cratering

Technical Library | 2020-05-08 18:22:31.0

A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.

ACI Technologies, Inc.

New BGA Solder Mask Repair Technique Using Laser Cut Stencils

Technical Library | 2007-02-01 10:08:40.0

The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.

BEST Inc.

Videos: bga exposed pad (30)

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Training Courses: bga exposed pad (12)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga exposed pad (2)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga exposed pad (1)

Packaging Engineer

Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support

SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic

Texas Instruments

Career Center - Resumes: bga exposed pad (7)

New Product Introduction(NPI) Engineer

Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support

New Product Introduction & Product dovelopment

12 Years experience in Equipment, Manufacturing and Technical Support.

Career Center | , | Engineering,Technical Support

COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot

Express Newsletter: bga exposed pad (573)

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

Partner Websites: bga exposed pad (1044)

BGA Pad Repair – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-pad-repair

BGA Pad Repair – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc

Precision PCB Services, Inc

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling

Heller Industries Inc.


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