Industry Directory: bga flip chip (84)

Precision PCB Services, Inc

Industry Directory | Consultant / Equipment Dealer / Broker / Manufacturer's Rep / Service Provider / Training Provider

Products, Services, Training, and Consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agent in North America for Shuttle Star BGA Rework Stations.

FlipChips Dot Com

Industry Directory |

A free dedicated, neutral site for flip chip information, including technical articles, tutorials, technology updates, and qualified suppliers.

New SMT Equipment: bga flip chip (1362)

DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet

New Equipment | Dispensing

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi

Nordson ASYMTEK

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

New Equipment | Cleaning Agents

pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of se

ZESTRON Americas

Electronics Forum: bga flip chip (593)

flip chip tolerances

Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont

I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Used SMT Equipment: bga flip chip (138)

Siemens SIPlace 80 F3

Siemens SIPlace 80 F3

Used SMT Equipment | Pick and Place/Feeders

996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz

Baja Bid

Fuji IP-III

Fuji IP-III

Used SMT Equipment | Chipshooters / Chip Mounters

1999 Fuji IP-III SMT Pick & Place Note: This lot contains two items. (1) Fuji IP-III SMT Pick & Place Approx Dimensions: 126" x 78" x 78" (1) Fuji MTU-4R Tray Tower Approx Dimensions: 43" x 87" x 70" Location: Jasper, IN USA Serial: 1514 Features: o

Baja Bid

Industry News: bga flip chip (604)

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Industry News | 2014-06-22 19:12:37.0

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.

MIRTEC Corp

Nordson ASYMTEK's LED Dispensing Applications Highlighted at LED Korea, Booth #4228, Hall B

Industry News | 2013-01-28 02:11:23.0

Offers precise, repeatable dispensing of phosphor for coating and encapsulation

Nordson ASYMTEK

Parts & Supplies: bga flip chip (210)

Samsung PC133S-333-542 133MHZ 512MB

Samsung PC133S-333-542 133MHZ 512MB

Parts & Supplies | Assembly Accessories

PC12P Inventory Material: Copper Clad FR4, Single Sided, 2 oz. Series: - Size Dimension: 18.00" x 12.00" (457.4mm x 304.8mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: Copper Clad, Positive Sensitized PC12P-E RFQ

KingFei SMT Tech

Yamaha YV 100II

Yamaha YV 100II

Parts & Supplies | Pick and Place/Feeders

Yamah YV100 II parameter 1. Highways based on the reliability of basic structures 2. Paste of protective elements 3.0.25 seconds / CHIP high-speed mount 4. Can mount 0.5 foot spacing 32mm QFP 5. High Speed Image Processing 6.2 cameras reduced p

KingFei SMT Tech

Technical Library: bga flip chip (44)

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Cleaning High-power Electronics

Technical Library | 2009-01-06 00:06:30.0

To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary.

ZESTRON Americas

Videos: bga flip chip (61)

iico, upcycle to affordability, flexibility and performance

iico, upcycle to affordability, flexibility and performance

Videos

The new iico system from Europlacer is ideal for small businesses and dedicated prototype operations providing a rapid return on investment. Upcycle to the flexibility of an "iico system" with the latest proven Europlacer innovations ready for curren

EUROPLACER

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

Nordson ASYMTEK

Training Courses: bga flip chip (7)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga flip chip (12)

Defluxing of Copper Pillar Bumped Flip-Chips April 26th

Events Calendar | Tue Apr 26 00:00:00 EDT 2022 - Tue Apr 26 00:00:00 EDT 2022 | Manassas, Virginia USA

Defluxing of Copper Pillar Bumped Flip-Chips April 26th

ZESTRON Americas

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: bga flip chip (23)

Sr. Manufacturing Engineer with over 20 yrs experience

Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production

Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver

12 Years experience in Equipment, Manufacturing and Technical Support.

Career Center | , | Engineering,Technical Support

COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot

Express Newsletter: bga flip chip (625)

Partner Websites: bga flip chip (5488)

FLIP CHIP

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0354-flip-chip

FLIP CHIP ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● Gen6 ● D9600 ● D9600Z PRODUCTION ● FastLine P300 ● Facts2 DF2400

ASYMTEK Products | Nordson Electronics Solutions

Flip Chip cleaning

ZESTRON Americas | https://www.zestron.com/sa/cleaning-applications/power-electronics-cleaning/flip-chip-packages.html?view=276

Leadframes & Discrete Components Cleaning Power LEDs Flip Chip Packages Camera Modules BGA Cleaning Cleaning Agent Technologies Modern Solvents FAST Technology MPC Technology Hydron Technology Cleaning Processes

ZESTRON Americas


bga flip chip searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next
Industry 4.0 Reflow Oven

Benchtop Fluid Dispenser
2022 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications
Pillarhouse USA for handload Selective Soldering Needs

Outstanding liquid dispensing and UV curing, all within one platform, watch the video.