Electronics Forum: bga flip chip (Page 1 of 60)

flip chip tolerances

Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont

I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Re: flip chip bonder

Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel

Re: flip chip bonder

Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det

Conductive Adhesives and flip chip

Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef

Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur

Conductive Adhesives and flip chip

Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan

HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver

Help for soldering mirco bga

Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg

Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su

BGA, COB,flip chip

Electronics Forum | Mon Jan 22 12:25:03 EST 2001 | dbonilla

Hi: I am looking for companies or consultants that can assists Manufacturing Technology Services ( Technology Alliance Division) to grow in advanced technology processes like BGA, Flip Chip, flex circuits, COB and others. I wish to know availability

BGA, COB,flip chip

Electronics Forum | Sun Jan 28 15:34:01 EST 2001 | Kelvin

Dear David, I suppose you may contact Cookson Performance Solution. They offer quite a wide range of service. http://www.cooksonsolutions.com I hope you find it useful. Kelvin

BGA, COB,flip chip

Electronics Forum | Mon Jan 29 10:26:21 EST 2001 | CAL

David- The information you ask about is what we deal with on an every day basis. We can entertain your questions off line at your convenience. The POC here at ACI you need to speak with is Mike Czajkowski (CHI-Kow-ski). He should be able to provide d

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