Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
Industry Directory | Manufacturer
Manufacturer of PCB assembly and final finished product assembly since 1997, our product include telecommunication products, safety devices, home securities, industrial electronics, as well as consumer electronics.
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Rework & Repair Equipment
Automatic bga rework machine soldering desoldering station bga rework station board repair Features: 1. Hot air heater head and mounting head are designed 2 in 1, with auto pick-up,auto solder,auto desolder and auto placement function. 2. Th
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Fri Aug 22 03:19:08 EDT 2008 | andrzej
Hi, what do you mean by collapsed ? Can you describe or send a photo ?
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high
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Used SMT Equipment | Pick and Place/Feeders
Yamaha YSM10 Pick And Place Machine Features: YSM series entry model mounter that achieved both the world’s fastest speed and versatility in its class worldwide! Ultimate basic machine featuring the three “1
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2009-03-16 18:07:28.0
OXFORD, CT � March 2009 � MIRTEC, �The Global Leader in Inspection Technology,� announces that it will introduce the latest advancements to its MV Series of AOI systems as well as unveil the company's first In-Line SPI System, the MIRTEC MS-11, in booth 147 at the upcoming APEX exhibition & conference scheduled to take place March 31- April 2, 2009 in Las Vegas.
Parts & Supplies | Repair/Rework
PG-P6800 Main Features： 1、There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB boar
Parts & Supplies | Repair/Rework
PG-P6860 Main Features： 1、 The top heater can move freely along the X, Y axis in the IR preheating area. It is good for many BGA chips distribution at different positions in the PCB board which need repair. X-shaped infrared laser can do rapid lo
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| http://www.szhonreal.com/productview.asp?id=42
*80mm Working table adjustment ± 10mm Forward/backward, ± 10mm left/right PCB locating way Jig Placement precision ± 0.01mm Min.pitch of BGA ball 0.15mm Bottom IR preheat 3600W Top heater 1200W Bottom heater 800W Max BGA weight 80g Power supply Single phase 220V,50/60Hz, Machine dimension L750
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
“The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability” [5] Investigation Specifics: 225 I/O Plastic BGA, daisy chained, 0.762mm (30 mil
