Industry News: bga placer (Page 1 of 2)

Essemtec to Highlight EXPERT-SAFP with BGA Placer at SMTA Long Island Expo and Technical Forum 2011

Industry News | 2011-09-01 22:08:39.0

Essemtec will exhibit Swiss Made, highly flexible SMD placement systems for prototyping and low volumes at the upcoming SMTA Long Island Expo and Technical Forum.

ESSEMTEC AG

Productronica 2021 Messe Munchen - Most Popular Trade Fair for SMT and PCBA Electronics Assembly

Industry News | 2021-11-14 21:01:12.0

Productronica 2021 is an innovative, unrivaled, and international event. This is one of its kind of events that showcase the entire value chain in the production industry of electronic goods – from technology and components to software and services, including supply chain, Stencil Screen Printer, Pick & Placer, SPI, Reflow over, X-Ray inspection, BGA repair and maintenance. As an international trade fair, Productronica Munich 2021 covers the entire range of present and futuristic products, technologies, and system solutions.

Unicomp Technology Co., Ltd

Martin Streamlines and Simplifies Rework with New Process Shuttle

Industry News | 2013-11-27 15:30:07.0

Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.

Finetech

Europlacer to Exhibit Dual-Gantry Xpress 25 at APEX 2008

Industry News | 2008-03-19 14:25:04.0

APEX, NC - March 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will feature a dual-gantry Xpress 25 flexible high-volume SMT placement system in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.

EUROPLACER

Essemtec Premiers New Pick-and-Place System for 3D-MID

Industry News | 2008-11-18 17:22:43.0

Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.

ESSEMTEC AG

Europlacer to Debut iineo-II Placement System at APEX 2008

Industry News | 2008-03-04 12:05:25.0

APEX, NC - January 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new iineo-II SMT platform in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.

EUROPLACER

Europlacer to Display iineo-II Placement System at IPC Midwest 2008

Industry News | 2008-09-14 15:09:42.0

APEX, NC - September 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase its iineo-II SMT platform in booth 423 at the upcoming IPC Midwest Conference & Exhibition that is scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.

EUROPLACER

Europlacer to Exhibit IINEO-2 Placement System at APEX 2009

Industry News | 2009-03-10 19:05:30.0

APEX, NC - January 2009 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its IINEO-2 SMT platform in booth 473 at the upcoming APEX 2009 Conference & Exhibition that is scheduled to take place March 31-April 2, 2009 in Las Vegas.

EUROPLACER

Europlacer to Exhibit IINEO-2 Placement System & Wireless Stock Management System at IPC Midwest 2009

Industry News | 2009-08-28 12:27:42.0

APEX, NC - September 2009 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its IINEO-2 SMT platform, long with its Wireless Stock Management System in booth 513 at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 23-24, 2009 at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, IL.

EUROPLACER

Europlacer to Exhibit IINEO-2 Placement System at IPC Electronics Midwest 2010

Industry News | 2010-09-01 21:53:51.0

Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its IINEO-2 SMT platform, in booth 7817 at the upcoming IPC Electronics Midwest Conference & Exhibition, scheduled to take place September 28-30, 2010 at the Donald E. Stevens Convention Center in Rosemont, IL.

EUROPLACER

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