Industry Directory: bga reduction (5)

Future Designs, Inc.

Industry Directory |

Engineering Services Company, Electronic Engineering, Software, Embedded Systems,Prototypes, Production Supply Chain Management.

Zurvahn LLC

Industry Directory | Other

Supply chain management expert, Zurvahn is an Electronic Manufacturing Service provider for mid- to low-volume products to Original Equipment Manufacturers worldwide.

New SMT Equipment: bga reduction (442)

DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet

New Equipment | Dispensing

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi

ASYMTEK Products | Nordson Electronics Solutions

I.C.T Digit Electronic Smd Component Counting Systems X Ray Chip Counter

I.C.T Digit Electronic Smd Component Counting Systems X Ray Chip Counter

New Equipment | Component Counters / SMD Counters

I.C.T | Smt Reel Digit Component Counting Systems Smd X-ray Chip Counter Overview Features: ● "99.98 ~ 100% " Accuracy● Best counting speed "around 7 secongds/ reel" ● 7 reel simultaneous 3x Counting speed "around 7 seconds" ● Including load

Dongguan Intercontinental Technology Co., Ltd.

Electronics Forum: bga reduction (61)

stencil thickness for bga

Electronics Forum | Mon Oct 13 13:49:29 EDT 2003 | mrmaint

Does anyone know of a standard stencil thickness for BGA'S. We currently use 4 to 5 mil stencils depending on component mix. Is an aperature reduction required for BGA'S. If so what percentage. Any help would be greatly appreciated. Thanks MRMAINT

BGA PAD REDUCTION

Electronics Forum | Fri Jul 30 20:27:49 EDT 1999 | Dior

Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board.

Used SMT Equipment: bga reduction (1)

Samsung SMT Pick and place machine samsung SM421 machine

Samsung SMT Pick and place machine samsung SM421 machine

Used SMT Equipment | Pick and Place/Feeders

Model: SM421 Mounting speed: 1608 Chip 21,000CPH 1005 Chip 20,000 CPH SOP16:15,000 CPH/feeder QFP100:5,000 CPH/tray Component recognition range:0402 ~ □7mm IC (CSP 0.65) 0603 ~ □12mm IC (CSP 0.75)  ~  □17mm IC (0.3P) ~  □42

Leaderway Industrial Co.,Ltd

Industry News: bga reduction (34)

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

YXLON International and MIRTEC Announce Close Cooperation Empowering Industry 4.0 in the Electronics Production Market

Industry News | 2015-05-07 19:28:29.0

MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.

MIRTEC Corp

Parts & Supplies: bga reduction (11)

Juki SMT Machine Parts JUKI FX-3 FX-3R POWER SUPPLY 40048006 FH0420BP5

Juki SMT Machine Parts JUKI FX-3 FX-3R POWER SUPPLY 40048006 FH0420BP5

Parts & Supplies | Assembly Accessories

SMT Machine Juki Spare Parts JUKI FX-3 FX-3R POWER SUPPLY 40048006 FH0420BP5 JUKI Pats Specifications: Brand Name JUKI FX-3 FX-3R POWER SUPPLY Part Number 40048006 Model Number FH0420BP5 Ensure Test in machine confirmation Guarantee 1 mon

KingFei SMT Tech

Juki JUKI OUT SENS ASM 40002210 JPG

Juki JUKI OUT SENS ASM 40002210 JPG

Parts & Supplies | SMT Equipment

contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000

ZK Electronic Technology Co.,Limited

Technical Library: bga reduction (1)

Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging

Technical Library | 2022-10-31 17:09:04.0

The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.

CALCE Center for Advanced Life Cycle Engineering

Videos: bga reduction (297)

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

ASYMTEK Products | Nordson Electronics Solutions

X ray counting machine

X ray counting machine

Videos

This video presents how to replace and inspect BGA on PCB with our BGA rework station R720 & X ray inspection machine X6600. More details, pls contact me: WhatsApp?+86 18779975930 Skype?joyrongzhuomao@outlook.com Email: sales25@zhuomao.com.cn Link

Seamark zm Tech Group

Career Center - Jobs: bga reduction (2)

SMT Engineering Supervisor

Career Center | Reynosa, Mexico | Engineering

This position is in our Reynosa manufacturing facility, which is across the border from McAllen, Texas.  In this critical role, you will be responsible for PCBA, SMT, THT, Wave Solder and secondary operations which will include: =Ensure producti

AMETEK ISCD

SMT Process Engineer

Career Center | Huntington Beach, California USA | Engineering

Trantronics, Inc. A well-established electronics assembly company who specializes in outstanding customer services and on time delivery is seeking a motivated hardworking individual to john our team at the Hunting Beach location. Responsibilities

TRANTRONICS, INC.

Career Center - Resumes: bga reduction (14)

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Express Newsletter: bga reduction (532)

Partner Websites: bga reduction (344)

BGA Footprint - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-footprint_topic2430_post10003.html

BGA Footprint - PCB Libraries Forum   Forum Home > PCB Footprint Expert > Questions & Answers    New Posts    FAQ    Search    Events    Register    Login BGA Footprint

PCB Libraries, Inc.

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing

Heller 公司


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