Industry Directory | Manufacturer
Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Mon Oct 30 21:00:31 EST 2006 | hanocete
thanks for your inputs,but what i meant was that a connector component beside the BGA for repair has some flux residue on its leads after baking, the BGA was Ok. we are wondering why this happened...pls enlightened us.
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2014-09-18 17:55:32.0
SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Technical Library | 2016-05-26 15:07:36.0
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides, in corrosion studies, the role of salt residues -with Cl ion- on some metals is known as being promoters of oxidation or corrosion. On the other hand, most of corrosion studies with tin metallization are focused mainly on the corrosion resistance of tin alloys, but little has been done respecting to the influence of salts on tin metallization wetting. In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Technical Library | 2011-09-01 18:11:31.0
Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it, the objective is the same, namely the clean up of remaining solder after a component (particularly a BGA) or R.F. Shield has been removed from a PCB. This paper will describe the various methods that are available and discuss their pros and cons.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Events Calendar | Tue Mar 07 08:00:00 EST 2017 - Tue Mar 07 14:00:00 EST 2017 | Rolling Meadows, Illinois USA
Rework Symposium
Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA
Kester to Host Technical Rework Seminar
SMTnet Express, July 27, 2017, Subscribers: 30,636, Companies: 10,649, Users: 23,563 Electrochemical Methods to Measure the Corrosion Potential of Flux Residues Mike Bixenman, DBA, David Lober, Anna Ailworth - KYZEN Corporation , Bruno Tolla, Ph
SMTnet Express, February 9, 2017, Subscribers: 30,132, Companies: 15,113, Users: 41,841 Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue? Eric Bastow; Indium Corporation The SMT assembly world
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
. If not cleaned properly flux residue can become acidic and diminish the reliability of the device. For flip chip and BGA applications, flux residue has the potential be trapped between interconnects, blocking underfill flow
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/amtech-nws-4400-ha-tf-water-washable-lead-free-tacky-solder-flux-rem1
residue is completely water soluble! Share 0 Share on Facebook Tweet Tweet on Twitter Pin it 0 Pin on Pinterest Fancy Add to Fancy +1 +1 on Google Plus Latest News Introducing our New Model RW-SV2000A BGA Rework Station Precision PCB Services, Inc
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