Industry Directory: bga thermal pad (33)

SinkPAD Corporation

Industry Directory | Manufacturer

An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.

T-KING Technology Co., Ltd.

Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer's Representative

KIC Thermal Profiling KIC2000 Cheap wholesale KIC Thermal Profiling KIC2000 BGA rework station Cheap wholesale KIC Thermal Profiling KIC2000 KIC Thermal Profiling KIC2000 Cheap wholesale KIC Th

New SMT Equipment: bga thermal pad (144)

PCB Rework and Repair Training

New Equipment | Education/Training

This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more.  Students will be introduced to the proper techniques for SMT & PTH compon

Precision PCB Services, Inc

BGA Rework Training & Certification

BGA Rework Training & Certification

New Equipment | Education/Training

This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the

Precision PCB Services, Inc

Electronics Forum: bga thermal pad (1698)

Solder short-BGA with thermal pad

Electronics Forum | Tue Feb 18 19:07:21 EST 2003 | arturoflores

Our case is not due to thermal pad print squeezing because our shorts are mostly in the outer rows of the BGA so they cannot be caused by central pad printing. We still stick to the BGA thermal pad coplanarity/height hypothesis but have not yet prove

Solder short-BGA with thermal pad

Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef

Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta

Used SMT Equipment: bga thermal pad (12)

Pillarhouse JADE MKII

Used SMT Equipment | Soldering - Selective

Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati

Midwest SMT

Manncorp RW1210

Manncorp RW1210

Used SMT Equipment | Repair/Rework

Manncorp RW1210 SMT / BGA Rework Station Vintage: 2014 1.3 Million Pixel, High-Definition, Split-Vision Optics with 230x Joystick-Controlled Zoom High-Resolution 15" Full Color LCD Display for Simultaneous, Superimposed Viewing of Component Leads

Assured Technical Service LLC

Industry News: bga thermal pad (407)

GPD Global's PCD Dispensing on Its MAX Series Platform Recognized with Two 2011 Global Technology Awards

Industry News | 2011-11-20 13:36:13.0

GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform

GPD Global

GPD Global's PCD Dispensing on Its MAX Series Platform Wins Another Industry Award

Industry News | 2012-03-05 14:26:45.0

GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.

GPD Global

Parts & Supplies: bga thermal pad (665)

Juki 710 head motherboard E8621715BA0 E86227150A0

Juki 710 head motherboard E8621715BA0 E86227150A0

Parts & Supplies | Pick and Place/Feeders

JUKI 710 head motherboard E8621715BA0 E86227150A0 Other juki parts: E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM E86

ZK Electronic Technology Co., Limited

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0

Parts & Supplies | SMT Equipment

SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0 Specifications: Brand Name JUKI IMG-P IMAGE BOARD Part number E86107210A0 Model IMG-P Ensure Test in machine confirmation Guarantee 3 month u

KingFei SMT Tech

Technical Library: bga thermal pad (58)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

StencilQuick™ Lead-Free Solder Paste Rework Study

Technical Library | 2007-01-31 15:17:04.0

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.

BEST Inc.

Videos: bga thermal pad (213)

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Training Courses: bga thermal pad (15)

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga thermal pad (8)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga thermal pad (1)

Packaging Engineer

Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support

SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic

Texas Instruments

Career Center - Resumes: bga thermal pad (13)

PCB Layout Designer

Career Center | Coimbatore, Tennessee India | 2017-06-05 07:55:08.0

Engineering

SMT process engineer

Career Center | NORTHRIDGE, California USA | Engineering

EDUCATION BS Electronics and Communication Engineering                Gujarat University MS Electrical Engineering        California State University, Northridge  ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE

Express Newsletter: bga thermal pad (684)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part

Partner Websites: bga thermal pad (2454)

BGA Pad Repair – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-pad-repair

BGA Pad Repair – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc

Precision PCB Services, Inc

Thermal Conductive Insulators

ORION Industries | http://orionindustries.com/pdfs/thermal.pdf

. Sil-Pad , Gap Pad, and Q-Pad are registered trademarks of The Bergquist Company. One Orion Park Drive, Ayer, MA 01432 • Phone: 978-772-6000 • Fax: 978-772-0021 • E-mail: info@orionind.com • www.orionindustries.com ORION INDUSTRIES INCORPORATED GAP PADS Material Thickness Range Thermal Conductivity Gap Pad V0 Soft

ORION Industries


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