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SnAgCuBi and SnAgCuBiSb solder joint properties investigations SnAgCuBi and SnAgCuBiSb solder joint properties investigations This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb
SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
