ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/thermal-interface-material-tim
. This paste-like material offers performance similar to thermal grease, without the risk of material pump out, and is suitable for achieving greater bond line thicknesses (BLT
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/thermal-compound-glossary
. Bleed Out The interface material migrates out from between two surfaces after a period of use. Bond Line Thickness (BLT) The thickness at which a thermal interface material (TIM
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/thermal-compound-dictionary
B Bleed Out The interface material migrates out from between two surfaces after a period of use. Bond Line Thickness (BLT) The thickness at which a thermal interface material (TIM
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
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