Industry Directory | Consultant / Service Provider
Lead Conditioning, Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing Services
Super powerful expanding desiccant to keep boards & microelectronics moisture free.... Much different than Silica Sand Beads. Also supplier of corrosion prevention treatments that are alternatives to Conformal coatings.
New Equipment | Education/Training
This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the
MODEL 80 - For medium to large boards Overall Dimensions: L: 476 W: 508 D: 457 mm Board Capacity: W: 457 D: 457 mm - Standard card guides are 317,5 mm deep, optional 457 mm guides for very large boards. - 75 numbered slots measure 2,8 x 3,9 mm on a 5
Electronics Forum | Sun Mar 20 14:47:29 EDT 2011 | floydf
We are going to be placing BGAs for the first time, and I have some questions. Is it recommended top bake all of the boards and all of the BGAs before production? I have had good luck baking boards that didn't wave solder well. It usually turns out
Electronics Forum | Wed Oct 02 13:59:11 EDT 2002 | davef
There are some excellent exhumation structures of high pressure and superhigh pressure metamorphic terranes in the Qinling-Dabie Mountain belt.
Used SMT Equipment | SMT Equipment
Baking SMT on a cheap kitchen toaster oven is not difficult. You just need some patience and exploration good will. In this page you will read the manual procedure to bake SMD boards into a regular kitchen toaster oven appliance. Follows information
Used SMT Equipment | Soldering - Reflow
MULTIPLE VITRONICS REFLOW OVENS AVAILABLE WWW.XLINEASSETS.COM - AUCTION ITEMS JABIL LIQUIDATION Featured Equipment: St. Petersburg, FL Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18
Industry News | 2024-09-18 14:19:59.0
Make sure you head over to the catalog and place your best and final bids ASAP!
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
Circuit Board Voids & PCB Delamination-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
| https://www.eptac.com/faqs/ask-helena-leo/ask/silver-immersion-finish-boards
. Baking will impact the solderability of the board, especially if they are as stated immersion silver boards. My recommendation is to assemble a board, bake it for at least 8 hours and process it through the wave solder process
