Videos: bond wedge (Page 1 of 1)

Viscom AOI

Viscom AOI

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High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

STI Capabilities

STI Capabilities

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The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

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bond wedge searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling Machine with CE

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Electronics Equipment Consignment

High Throughput Reflow Oven
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
Global manufacturing solutions provider

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...


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