New SMT Equipment: bondability of gold (Page 1 of 1)

Smart Tweezers ST5 - A New Generation of Digital Multimeters

Smart Tweezers ST5 - A New Generation of Digital Multimeters

New Equipment | Test Equipment

Smart Tweezers, from Canadian, Siborg Systems Inc., are the inventive combination of a powerful LCR-meter and a set of tweezers integrated into a pocket-sized device. Designed specifically for working with electronics using Surface Mount Technology,

Siborg Systems Inc

HANDY & HARMAN

New Equipment |  

Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...

West-Tech Materials

Multichip modules (MCM-L)

New Equipment |  

Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.

Metro Circuits, div. of PJC Technologies, Inc.

AlSi Bonding Pads

AlSi Bonding Pads

New Equipment | Materials

Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas

Heraeus Materials Singapore Pte Ltd

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

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