BELTCARE Solution specializes in producing &developing conveyor belt system rubber products, Our Cold bonding repair material, Ceramic&Diamond rubber Pulley Lagging won oversea users reputation for superior quality and service
BELTCARE Solution specializes in producing &developing conveyor belt system rubber products, Our Cold bonding repair material, Ceramic&Diamond rubber Pulley Lagging won oversea users reputation for superior quality and service
S-Bond joins metals, ceramics, carbon, carbides, and semiconductors making S-Bond a viable process assemble and bond sensors and sensor housings. Applications include the fluxless joining of electrical signal leads to sensor elements where twisted le
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Wed Jan 09 21:19:49 EST 2002 | davef
When I said "In this area, there is no difference between your experience in ceramic substrates and PTFE substrates." I was referring to the area we were discussing ... gold plating. I am sorry if you thought I ment than the wire bonding process wa
Industry News | 2012-08-28 09:54:11.0
Count On Tools Inc., announces a breakthrough in custom nozzle engineering for ultra-smooth components from the semiconductor market.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Parts & Supplies | AOI / Automated Optical Inspection
RF High Power Ceramic Capacitor 5KV~30KV/100pf~6000pf HV RF Disk / Plate ceramic capacitor, RF Barrel / Doorknob Capacitor, RF Feedthrough Capacitor, High Voltage Plate Ceramic Capacitor, High Power Ceramic Capacitor Manufacture Supply High Voltage
Parts & Supplies | ESD Control Supplies
25KV Water Cooled Ceramic Capacitor Manufacturer Supply 25KV 5000pf 2000Kva Water Cool Ceramic capacitor High Frequency RF ceramic capacitor, Watercooled power RF capacitor, RF pot capacitor, water cool capacitor Specifications: Rated Voltage (V)
Technical Library | 2016-01-12 11:03:35.0
With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application.
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Brooklyn, New York USA | Engineering,Management
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes The expression "multifunctional PCB", as a synonym for a PCB which is applicable with a variety
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/microdot-dispense-tips
. View All Products Bonding & Sealing Back Bonding & Sealing Bonding Gluing - Hot Melt Adhesive Gluing - Liquid Adhesive Sealing Soldering Coating Back Coating Coating - Conformal Coating - Container Coating - Fluid Coating - Hot Melt Adhesive Coating
| https://www.eptac.com/faqs/ask-helena-leo/page/3
1.56 ug/cm2... Read More Ceramic CCA's and Aqueous Wash and Bake Out Prior to Parylene Coating QUESTION Question: I have a question concerning ceramic CCA and their bake out after aqueous wash cycle prior to parylene coating
