Industry Directory: bottom (32)

Techcon Systems

Techcon Systems

Industry Directory | Manufacturer of Assembly Equipment / Adhesives / Dispensing

Techcon offers a wide array of fluid dispensing products and provides dispensing components ranging from disposable accessories to complete microprocessor-controlled dispensing systems, and precision valves.

BOTTOMS TECHNOLOGY INC.

Industry Directory |

CONTRACT MFG. CIRCUIT BDS.

New SMT Equipment: bottom (7336)

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

New Equipment | Reflow

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: bottom (2262)

Reflow oven bottom heaters

Electronics Forum | Thu Nov 16 22:01:06 EST 2017 | deanm

That model comes standard without bottom preheaters. Bottom preheaters are an option so I would think it is designed for general use unless you have some very thermally challenging boards. As long as you are within the process window, you'll be fine.

Reflow oven bottom heaters

Electronics Forum | Thu Nov 16 08:57:00 EST 2017 | jandon

We found used Ersa HotFlow 2/14 reflow oven that does not have bottom side preheaters. Can it be easily and safely used in normal high mix/low volume production or is it built for specific products which does not need bottom preheaters?

Used SMT Equipment: bottom (314)

Vitronics Soltec Delta 6622CC Wave Solder

Vitronics Soltec Delta 6622CC Wave Solder

Used SMT Equipment | Soldering - Wave

LEAD FREE - new pot in 2017  Spray Fluxer 1st section: Bottom  2nd Section: Bottom 3rd Section:  Bottom & Top Auto solder feeder Motorized roll out solder pot Finger wet & cleaner

Capital Equipment Exchange

SRT Summit 2100RD

SRT Summit 2100RD

Used SMT Equipment | Repair/Rework

● Bottom and top heaters reflow solder to remove components with BGA, gull wing leaded QFPs, and bottom termination components. ●Paste dispenser allows placement of precise paste dots. ● Dual mirror system for component alignment for removal an

Capital Equipment Exchange

Industry News: bottom (750)

Lean Stream & Heller Reflow Technology to Partner in CA & NV

Industry News | 2015-11-12 22:03:28.0

Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!

Heller Industries Inc.

Conformal Coating System For Under $40,000!!!

Industry News | 2017-11-07 23:20:25.0

GPD Global offers a cost-effective, automated Conformal Coating System (SimpleCoat) with excellent repeatability for just under $40,000!!!

GPD Global

Parts & Supplies: bottom (443)

Juki SMT MACHINE GENUINE JUKI FEEDER SPARE PARTS RFID TAG INSERT BOTTOM KIT 40073826

Juki SMT MACHINE GENUINE JUKI FEEDER SPARE PARTS RFID TAG INSERT BOTTOM KIT 40073826

Parts & Supplies | Assembly Accessories

SMT MACHINE GENUINE JUKI FEEDER SPARE PARTS JUKI FEEDER RFID TAG INSERT BOTTOM KIT 40073826 JUKI Pats Specifications: Brand Name JUKI FEEDER RFID TAG INSERT BOTTOM KIT Part number 40073826 Model JUKI CF AF EF ETF ETFR FEEDER SPARE PARTS En

KingFei SMT Tech

Juki RS232C CHANGE PCB 40026382

Juki RS232C CHANGE PCB 40026382

Parts & Supplies | Pick and Place/Feeders

MCM E9610729000 XMP CPCI 40003259 CPU BOARD 40003280 CPU BOARD 40044475 N-VERIFY I/F PCB 40029039 BANK FPI R PCB 40001949 BANK FPI F PCB 40001951 CAL BLOCK CIRCUIT BOARD E8609721OAO CARRY SENSOR RELAY PCB 40001964 TEMPRETURE SENSOR

KingFei SMT Tech

Technical Library: bottom (358)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: bottom (243)

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Videos

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

http://www.gpd-global.com Watch this amazing NCM5000 Jetting Pump Underfill Process. Underfill 6mm Die, dispense Namic 8410. More Info:http://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php Subscribe Now! https://www.youtub

GPD Global

Training Courses: bottom (3)

Non-Destructive BGA/Area Array Component Rework - Technical Workshop

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

PACE Worldwide

Events Calendar: bottom (63)

QFN: Design - Cleaning - Reliability: What you can't see can cause failure! Free Webinar

Events Calendar | Thu Oct 13 11:00:00 EDT 2016 - Thu Oct 13 11:00:00 EDT 2016 | Austin, USA

QFN: Design - Cleaning - Reliability: What you can't see can cause failure! Free Webinar

KYZEN Corporation

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Surface Mount Technology Association (SMTA)

Career Center - Resumes: bottom (2)

Sr. Process Improvement Engineer

Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support

Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.

NPI Engineer

Career Center | Theni, Tamilnadu India | Engineering

NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu

Express Newsletter: bottom (117)

SMTnet Express - October 23, 2014

SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company

Partner Websites: bottom (2099)

Bottom Side AOI Archives - Lewis and Clark

| https://www.lewis-clark.com/product-tag/bottom-side-aoi/

Bottom Side AOI Archives - Lewis and Clark Skip to content My Cart:  0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis

MV2C/F/B Cutter Blade Carbide (Bottom)

| http://www.nozzles4smt.com/MV2CFB-Cutter-Blade-Carbide-Bottom_p_987.html?delhist=548

MV2C/F/B Cutter Blade Carbide (Bottom) 800-538-0426 Welcome, Guest • Login View Cart Home About Us News Contact Us My Account Cart ( 0


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