Industry Directory: bottom heating (1)

Sikama International, Inc.

Sikama International, Inc.

Industry Directory | Manufacturer of Assembly Equipment

Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.

New SMT Equipment: bottom heating (1405)

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

New Equipment | Reflow

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: bottom heating (417)

IR oven profiling

Electronics Forum | Wed May 14 17:56:19 EDT 2003 | bradlanger

Does anybody have any advice on how to get a decent profile out of a 4 zone IR oven? Should top heat and bottom heat be proportionate? Are there any tricks to use?

Real power consumption of Heller 1707

Electronics Forum | Mon Dec 05 12:07:18 EST 2011 | pszumny

Hi, If somebody knows Real power consumtion of Heller 1707 with bottom heating, no active cooling ? I plan buy it. Thanks in advance.

Used SMT Equipment: bottom heating (100)

Vitronics Soltec DeltaMAX 6723CC Wave Solder

Vitronics Soltec DeltaMAX 6723CC Wave Solder

Used SMT Equipment | Soldering - Wave

Configuration Dual wave - smart & chip 3 pre heat sections Zone 1) Bottom side convection Zone 2) Bottom side convection Zone 3) topside IR, bottomside Cal Rod internal spray fluxer motorized pot r

Capital Equipment Exchange

Heller 1912EXL Reflow Oven

Heller 1912EXL Reflow Oven

Used SMT Equipment | Soldering - Reflow

12 Heated Zone (top & bottom) 3 cooling zones Edge / Mesh conveyance SMEMA Auto chain oiler Onboard profiler This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functio

Capital Equipment Exchange

Industry News: bottom heating (164)

Largest Dispensing Platform in the Industry

Industry News | 2017-04-11 21:19:32.0

GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.

GPD Global

See Seika Machinery, Inc.'s New Advanced Machinery at SMTA International 2011

Industry News | 2011-09-21 14:09:34.0

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its new advanced machinery in Booth #136 at the upcoming SMTA International Conference & Exhibition

Seika Machinery, Inc.

Parts & Supplies: bottom heating (12)

Surface Mount Techniques SMT heat-resistance type Magazine Rack , PCB Rack Magazine for PCB Size 460*(100-330)mm

Surface Mount Techniques SMT heat-resistance type Magazine Rack , PCB Rack Magazine for PCB Size 460*(100-330)mm

Parts & Supplies | SMT Equipment

SMT heat-resistance type Magazine Rack , PCB Rack Magazine for PCB Size 460*(100-330)mm Specification: Surface resistance: 104~106ω Common type and heat-resistance type are available. Overall Size: 460*400*563mm . Can accommodate 50 pieces of PC

KingFei SMT Tech

Surface Mount Techniques SMT heat-resistance type Magazine Rack , PCB Rack Magazine for PCB Size 350*(50-250)mm

Surface Mount Techniques SMT heat-resistance type Magazine Rack , PCB Rack Magazine for PCB Size 350*(50-250)mm

Parts & Supplies | SMT Equipment

SMT heat-resistance type Magazine Rack , PCB Rack Magazine for accommodated PCB Size 350*(50-250)mm Specification: Surface resistance: 104~106ω Common type and heat-resistance type(120℃ ) are available. Overall Size: 355*320*563mm . Can accommod

KingFei SMT Tech

Technical Library: bottom heating (197)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: bottom heating (44)

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Videos

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

http://www.gpd-global.com Watch this amazing NCM5000 Jetting Pump Underfill Process. Underfill 6mm Die, dispense Namic 8410. More Info:http://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php Subscribe Now! https://www.youtub

GPD Global

Training Courses: bottom heating (1)

Non-Destructive BGA/Area Array Component Rework - Technical Workshop

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

PACE Worldwide

Events Calendar: bottom heating (1)

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Surface Mount Technology Association (SMTA)

Express Newsletter: bottom heating (291)

SMTnet Express - August 8, 2019

SMTnet Express, August 8, 2019, Subscribers: 32,214, Companies: 10,853, Users: 25,321 Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat Credits: Alpha Assembly Solutions The requirement

Partner Websites: bottom heating (413)


bottom heating searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next