Industry Directory: caps (17)

Many Caps Consulting Ltd

Industry Directory | Consultant

We have over 20 years experience in the elctronics manufacturing sectors and work with companies to improve their productivity & manufacturing processes that keep you awake at night!

Many Caps Consulting Ltd

Industry Directory |

We have over 20 years experience in the elctronics manufacturing sectors and work with companies to improve their productivity & manufacturing processes that keep you awake at night!

New SMT Equipment: caps (2065)

Allen Bradley Rockwell A-B 1769-ECL CompactLogix Left End Cap/Terminator

Allen Bradley Rockwell A-B 1769-ECL CompactLogix Left End Cap/Terminator

New Equipment | Industrial Automation

Cambia Automation Limited       Contact  Freely Manager: Leeta Wu Email: sales2@cambia.cn company website:www.cambiaplc.com Mobile: +86 15960236674 Skype: +86 5960236674(Whatsapp/ Wechat) You Want to Know Wa

Cambia Automation Limited

6ES7194-4JD50-0AA0 ET200PRO CAPS FOR PUSH PULL SOCKETS 5PCS

6ES7194-4JD50-0AA0 ET200PRO CAPS FOR PUSH PULL SOCKETS 5PCS

New Equipment | Industrial Automation

Contact  Freely Manager: Leeta Wu Email: sales2@cambia.cn company website:www.cambiaplc.com Mobile: +86 15960236674 Skype: +86 5960236674(Whatsapp/ Wechat) You Want to Know Warranty: one year Condition: brand new and original Delivery t

Cambia Automation Limited

Electronics Forum: caps (1208)

0201 caps

Electronics Forum | Mon Dec 02 16:25:06 EST 2002 | jimlew

In doing process qualifications for 0201 caps, has anyone taken cross-sections and discovered cracks / hairline fractures / voids between the metalization on the end and the ceramic itself? (not cracks in the solder joint) We are well within the cap

0201 caps

Electronics Forum | Wed Dec 04 15:05:08 EST 2002 | dougt

How about building a panel and checking it out prior to sawing it up?

Used SMT Equipment: caps (19)

Fuji CP643E

Fuji CP643E

Used SMT Equipment | Chipshooters / Chip Mounters

FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca

Baja Bid

Fuji CP643E

Fuji CP643E

Used SMT Equipment | Chipshooters / Chip Mounters

FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca

Baja Bid

Industry News: caps (134)

Techcon Systems Introduces Blue End Caps for Syringe Barrels

Industry News | 2011-06-28 15:28:57.0

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces its new Blue End Caps for Syringe Barrels.

Techcon Systems

Techcon Systems Debuts Stand-Up Tip Caps for Syringe Barrels

Industry News | 2011-06-16 14:35:57.0

Techcon Systems, a product group of OK International introduces the new Stand-Up Tip Caps for use with luer lock syringe barrels.

Techcon Systems

Parts & Supplies: caps (2849)

Yamaha SMT Parts Bit Cap KHY-M7156-01 KHY-M7156-00 CAP For YS12 YS24 YS100 Valve

Yamaha SMT Parts Bit Cap KHY-M7156-01 KHY-M7156-00 CAP For YS12 YS24 YS100 Valve

Parts & Supplies | Assembly Accessories

Detailed Product Description Part Name: Bit Cap Part Number: KHY-M7156-01 KHY-M7156-00 Machine: YS12 YS24 YS100 Brand: Yamaha Condition: New Origin: China Bit Cap KHY-M7156-01 KHY-M7156-00 CAP For YS12 YS24 YS100 Valve Detail Information: 1

KingFei SMT Tech

Technical Library: caps (94)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: caps (58)

Samsung SAMSUNG SM431 TEHACHING BOX J90601023B

Videos

J9065106A          SUB FRAME ASS'Y                 J7165259A          SUB FRAME                 J7165266A          PUSHER LEVER BUSH 2                 J7065935A          CHUTE BLADE                                            J6107013A          T

Qinyi Electronics Co.,Ltd

Samsung SAMUSNG SM 32MM FEEDER TAPE GUIDER J9065235A

Videos

J9065106A          SUB FRAME ASS'Y                 J7165259A          SUB FRAME                 J7165266A          PUSHER LEVER BUSH 2                 J7065935A          CHUTE BLADE                                            J6107013A          T

Qinyi Electronics Co.,Ltd

Training Courses: caps (2)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Career Center - Resumes: caps (4)

Engineer- SMT

Career Center | , | 2013-01-31 04:29:34.0

• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010

Engineer- SMT

Career Center | , | 2013-01-31 04:45:28.0

• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010

Express Newsletter: caps (33)

Partner Websites: caps (1548)

FramelessTant Caps Nichicon - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/framelesstant-caps-nichicon_topic1164_post4573.html

FramelessTant Caps Nichicon - PCB Libraries Forum   Forum Home > PCB Footprint Expert > Product Suggestions    New Posts    FAQ    Search    Events    Register    Login FramelessTant Caps Nichicon

PCB Libraries, Inc.

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC

| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/

: Problems With Stress Cracks in Ceramic Components Question: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing


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