Industry Directory | Consultant / Service Provider
We have over 20 years experience in the elctronics manufacturing sectors and work with companies to improve their productivity & manufacturing processes that keep you awake at night!
We have over 20 years experience in the elctronics manufacturing sectors and work with companies to improve their productivity & manufacturing processes that keep you awake at night!
Easy to program, this 5 Zone reflow oven has 3 upper and 2 lower heating zones. Great for assembly of circuit boards as wide as 11.5 inches. Reflow all types of components including LED's, BGA'S, LGA's, QFN's, Resistors, Caps and more! Best of all
P/N Description 00047012-01 Cover cap CV-PK-4-B PUR 00047104-01 Blanking plug B-M5 Al 00047407-01 Elbow fitting LJK-3/8 00047555S01 Plastic Hose, PU-4, blue, 5m each 00048346-01 DIN 6799
Electronics Forum | Mon Dec 02 16:25:06 EST 2002 | jimlew
In doing process qualifications for 0201 caps, has anyone taken cross-sections and discovered cracks / hairline fractures / voids between the metalization on the end and the ceramic itself? (not cracks in the solder joint) We are well within the cap
Electronics Forum | Wed Dec 04 15:05:08 EST 2002 | dougt
How about building a panel and checking it out prior to sawing it up?
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2003-04-14 09:17:40.0
AeA Micro Cap Virtual Conference to be held Online May 16th
Industry News | 2003-04-14 09:02:03.0
The stock will be eligible to trade on the Over the Counter Bulletin Board (OTCBB) under the ticker symbol �DDIC� as early as April 15, 2003, provided a market maker enters a quote for the security.
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: Bit Cap Part Number: KHY-M7156-01 KHY-M7156-00 Machine: YS12 YS24 YS100 Brand: Yamaha Condition: New Origin: China Bit Cap KHY-M7156-01 KHY-M7156-00 CAP For YS12 YS24 YS100 Valve Detail Information: 1
Parts & Supplies | Assembly Accessories
KingFei SMT Tech
Technical Library | 2023-01-17 17:50:59.0
Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors.
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
J9065106A SUB FRAME ASS'Y J7165259A SUB FRAME J7165266A PUSHER LEVER BUSH 2 J7065935A CHUTE BLADE J6107013A T
J9065106A SUB FRAME ASS'Y J7165259A SUB FRAME J7165266A PUSHER LEVER BUSH 2 J7065935A CHUTE BLADE J6107013A T
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Career Center | , Ok Col. USA | Sales/Marketing
Tier 2 EMS restructured and new EMS seasoned management from Tier 1s. Must have contacts in pcba and Cap Equipment markets in Tx Ok Co. Six figure base. StepBeyond Research Contracted Search
Career Center | Bedford, Texas USA | Sales/Marketing
Sell SMT capital lines in the SE region for a major OEM provider. Candidate needs prior succesful track record selling to major accounts in the SE region and preferring contacts with major accounts there including any large contract manufacturers.
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Career Center | , | 2013-01-31 04:45:28.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/framelesstant-caps-nichicon_topic1164_post4573.html
FramelessTant Caps Nichicon - PCB Libraries Forum Forum Home > PCB Footprint Expert > Product Suggestions New Posts FAQ Search Events Register Login FramelessTant Caps Nichicon
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components
