Technical Library: cellular (Page 1 of 1)

The Power Packaging Laboratory at ACI Technologies

Technical Library | 2019-05-31 14:21:59.0

Microelectronics is the manufacture of systems built from extremely small electronic components. In today’s electronic world, devices must be portable, equipped with wireless technology and are driven by size, weight, power, and cost (SWaP-C). These system level drivers are crucial to all current and future electronic applications from personal computers and cellular telephones to military-fielded hardware, biomedical instrumentation, and space-flight hardware.

ACI Technologies, Inc.

Manufacturing Substrates with Embedded Passives

Technical Library | 2011-05-05 16:17:34.0

Passives account for a very large part of today’s electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, and computers. Market pressures for new products with more features, smaller size and lower cost v

i3 Electronics

A Compliant and Creep Resistant SAC-Al(Ni) Alloy

Technical Library | 2009-03-27 22:22:40.0

The Sn-Ag-Cu (SAC) alloys have been considered promising replacements for the lead-containing solders for the microelectronics applications. However, due to the rigidity of the SAC alloys, compared with the Pb-containing alloys, more failures have been found in the drop and high impact applications for the portable electronic devices, such as the personal data assistant (PDA), cellular phone, notebook computer..etc

Indium Corporation

Key Technology Choices For Optimal Massive IoT Devices

Technical Library | 2019-11-26 15:57:27.0

The latest cellular communication technologies LTE-M and NB-IoT enable the introduction of a new generation of IoT devices that deliver on the promise of scalable, cost-effective massive IoT applications using LPWAN technology. However, a few key technology choices are necessary to create IoT devices that can support the multitude of existing and emerging massive IoT use cases..

Ericsson AB

Recommendations for Board Assembly of Infineon Thin Small Discrete Packages without Leads

Technical Library | 2021-04-01 14:36:51.0

This document provides information about the Surface Mount Technology (SMT) board assembly of Infineon Thin Small Non-leaded Packages (TSNP). The specific dimensions of the leadframe based inner setup depend on the size of the chip and the type of bonding. The field of application ranges from linear voltage regulators for weight-limited applications such as cellular phones and digital cameras to linear voltage regulators for the automotive sector.

Infineon Technologies AG

5G - The Future of IoT

Technical Library | 2019-11-20 14:36:27.0

5G: The Future of IoT takes a look at the market drivers, trends and cellular technology solutions that will create our connected future. Market drivers provide added value through connectivity of all “things” ranging from street lighting to home appliances to industrial robotics. Providing connectivity to things has become easier with improvements in the economics of end devices, large investments in IoT systems, adoption of global standards and availability of spectrum. Overall trends in information technology such as cloud computing and edge cloud, artificial intelligence and security assurance have accelerated the IoT ecosystem. The whitepaper discusses some of the market segments in more details, including industrial IoT, smart cities, enterprise IoT and consumer IoT.

5G Americas

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