New SMT Equipment: ceramic qfn (38)

BGA Reballing Service

BGA Reballing Service

New Equipment | Rework & Repair Services

BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

BGA Rework Services Offered  BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

Industry News: ceramic qfn (6)

SMTA China Presents Awards at SMTA China East 2011

Industry News | 2011-05-16 16:53:28.0

SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.

Surface Mount Technology Association (SMTA)

Technical Library: ceramic qfn (8)

Voiding Control for QFN Assembly

Technical Library | 2011-04-07 14:50:29.0

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t

Indium Corporation

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Technical Library | 2019-04-17 21:29:14.0

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Jet Propulsion Laboratory

Videos: ceramic qfn (2)

PACE PH 100 Low Profile PCB Preheater

PACE PH 100 Low Profile PCB Preheater

Videos

Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective

PACE Worldwide

BGA Removal with PACE IR 1000 Infrared Rework System

BGA Removal with PACE IR 1000 Infrared Rework System

Videos

In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r

PACE Worldwide

Express Newsletter: ceramic qfn (104)

Partner Websites: ceramic qfn (8)

Application Notes

">ASYMTEK Products | https://www.nordson.com/en/divisions/sonoscan/support/application-notes

  Plastic ICs/PEMs Flex Circuit Smart Card Bonded Wafers Chip Scale Package Flip Chip Hybrid Ceramic Solar Cells Packaging, Seals Materials Other   Plastic ICs/PEMs

">ASYMTEK Products

Best Papers - Award Winners - SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

: Mike Bixenman, DBA, KYZEN Corporation " BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes " 2015

Surface Mount Technology Association (SMTA)


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High Speed Precision In-Line SPI System - Mirtec MS-11
Jwide professional SMT machines manufacturer

Pana Nozzles
Find a wide selection of nozzles at SALESCON