New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Industry News | 2013-02-05 14:13:33.0
BGA Rework System Demo Tour
Industry News | 2011-05-16 16:53:28.0
SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.
Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective
TI New and Original INA146UA in Stock IC SOP8 ,21+ package INA146UA High Voltage Programmable Gain Differential Amplifier VOS617A-3X001T SOP4 VISHAY 15+ STM32F407ZGT6 LQFP144 ST 22+ MT53E128M32D2DS-046 AUT:A BGA MICROCHIP 21+ R5F100LG
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Plastic ICs/PEMs Flex Circuit Smart Card Bonded Wafers Chip Scale Package Flip Chip Hybrid Ceramic Solar Cells Packaging, Seals Materials Other Plastic ICs/PEMs
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
1706 exl 1800exl 1707 mark 5 heller Uf3800 underfill Hac1 manual Vapor phase reflow Rma 204 Reflow soldering on surface mount Reflow qfn Reflow temperature for lead solder Hex250l Training Reflow
