106 ceramic qfn results

Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes

Power Supply Control from PCB to Chip Core

The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains

Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors

Flexible Termination - Reliability in Stringent Environments

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

SMT Express, Volume 2, Issue No. 11 - from SMTnet.com

SMTnet Express - June 15, 2017

SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International

SMT Express, Volume 5, Issue No. 2 - from SMTnet.com

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN