Career Center - Jobs: chipping (Page 1 of 4)

CSP/BGA Applications Engineer

Career Center | , | Engineering

A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment

Eden Associates

SMT Engineer

Career Center | , New Jersey USA | Engineering

Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures

Circuit Search

Process and Product Support Engineers

Career Center | , New Jersey USA | Engineering

Several opportunities for skilled SMT Engineers and Product Support Engineers. Skilled in lean manufacturing and Kaizen. Skilled in working with BGA, Flip Chip and other related technologies. Skilled in new product introduction and line support acti

Circuit Search

Process Engineer

Career Center | Greenville, South Carolina USA | Engineering

Process engineer with flip chip and die bonding experience is needed for a well-established company in South Carolina. This is a new position. Relocation is available. BS is required. Send resume as a Word attachment to sfrederick@connectipro.com.

Connecti*Pro

Printed Circuit Board Assembly Equipment Sales Manager

Career Center | San Jose, California USA | Sales/Marketing

Sales Manager PCB Manufacturing Equipment: This candidate will be responsible for selling a complete line of Japanese PCB (Printed Circuit Board) manufacturing equipment, including chip shooters, chip placers, etc. The sales territory is the entire

Executive Resource Group, Inc.

Process Engineer and Technician

Career Center | , | 2001-05-16 15:58:28.0

Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning

Design for Test (DFT) / ATE Test Background

Career Center | San Jose, California USA | Engineering,Research and Development

www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som

SRQ Consultants LLC

Sales Engineers

Career Center | New Delhi, New Delhi India | Sales/Marketing

Equipment related to PCB Assembly ( wave soldering , Selective soldering , reflow , pick'n'place system , PCB Inspection system , PCB Rework System ,Flip - Chip Bonding system , Component forming system ). ---> Equipment relat

PCI Limited

Electronic Packaging Engineer

Career Center | Melbourne, Florida USA | Engineering,Research and Development

Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ

Harris Corporation

SMT Operators

Career Center | Middleboro, Massachusetts USA | Production

Highly motivated SMT Repair/ Assembly Operators needed for Contract Electronics Manufacturer. Duties include: repair and soldering of SMT and TH components, assembling of PCB's, and operation of automated production equipment. Experience using vario

Glynn Technologies and Manufacturing

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