Industry Directory: class (340)

EPTAC Corporation

EPTAC Corporation

Industry Directory | IPC Standards Certification Center / Training Provider

EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.

Imagineering, Inc.

Imagineering, Inc.

Industry Directory | Manufacturer of Bare PCBs / Assembly / Design / Turnkey / Contract Manufacturer

Since 1986, our focus on delivering quality PCB's and Assemblies hasn't changed. Our top priority has always been to understand what the customer values, evaluate their needs and deliver the best-in-class service and products.

New SMT Equipment: class (10117)

Hand Soldering Training

Hand Soldering Training

New Equipment | Education/Training

The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo

Blackfox Training Institute, LLC

DSP863 HALOGEN FREE No-Clean Lead Free Solder Paste

New Equipment | Solder Materials

863 exhibits excellent wettability, extended stencil life, superior hot slump, and low voiding. Flux class ROL0. Exceeds J-Std-006. 863 provides excellent print definition. Good release is seen on 12-9 mil apertures with print speed of 1.0-6.0 inch p

Qualitek International, Inc.

Electronics Forum: class (796)

class 3 filet height

Electronics Forum | Wed Oct 26 14:29:55 EDT 2005 | barryg

We have a class 3 assembly we will be doing soon and I was wandering since the fillet heighth required for class 3 is 50% more than class 2, should I have my stencil thickness increased from 6 mil. to 7 mil.? This assembly is made up of 31 mil. pitch

class 3 filet height

Electronics Forum | Thu Oct 27 07:57:35 EDT 2005 | Bob R.

Nearly all of our assemblies have to meet class 3 requirements and we regularly use 5 and 6 mil stencils. If you've got reasonably well controlled processes you won't have any trouble getting class 3 joints on QFPs and discretes.

Used SMT Equipment: class (267)

Agilent 5300 5DX Series

Agilent 5300 5DX Series

Used SMT Equipment | Visual Inspection

AGILENT, X Ray inspection machine, In line, type 5300-5DX-SERIES 3, SN: US40690565, double top opening, laser class 1, laser subsystem class 3B, equipped with double PC inside, monitor control AGILENT, included small table with standard monitor and k

Baja Bid

Juki SMT Pick and Place Machine RS-1R

Juki SMT Pick and Place Machine RS-1R

Used SMT Equipment | Pick and Place/Feeders

Feature Class leading speed, up to 47,000 cph Newly developed “Takumi Head” with changing recognition sensor height Optimum line balance and highest throughput Wide component range from 0201 (metric) to large connectors and ICs Optim

Leaderway Industrial Co.,Ltd

Industry News: class (2634)

Heller opens Cleanroom in New Jersey Factory.

Industry News | 2013-09-10 17:48:54.0

We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.

Heller Industries Inc.

i4.0 Connect Forum - Fremont Marriott Silicon Valley

Industry News | 2019-09-12 22:51:52.0

Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.

Heller Industries Inc.

Parts & Supplies: class (274)

Yamaha YVL88 YV88II Cyberoptics Laser Sensor 6604098 Class I Laser Products Used

Yamaha YVL88 YV88II Cyberoptics Laser Sensor 6604098 Class I Laser Products Used

Parts & Supplies | Sensors

Detailed Product Description Brand: Cyberoptics Part Name: Laser Sensor Model: 6604098 Condition: Original Used Application: Yamaha YVL88 Warranty: 3 Months Yamaha YVL88 YV88II CyberOptics Laser 6604098 Class I Laser Products Used Description

KingFei SMT Tech

Surface Mount Techniques SMT Cleanroom Microfibre Wiper papaer

Surface Mount Techniques SMT Cleanroom Microfibre Wiper papaer

Parts & Supplies | SMT Equipment

SMT Cleanroom Microfibre Wiper paper Applications: Superior for spill control and general wiping in Class10~1,000 environments; Cleaning and polishing the products TFT-LCD, Optical and other critical industries etc.request; Maintaining critica

KingFei SMT Tech

Technical Library: class (170)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Risk Mitigation in Hand Soldering

Technical Library | 2019-01-02 21:51:49.0

Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.

Metcal

Videos: class (274)

Highlights of 2018 - Video Interview Marc Peo

Highlights of 2018 - Video Interview Marc Peo

Videos

The i4.0 Connect Forum will return this October (2nd & 3rd) to the heart of Silicon Valley for our second US Industry 4.0 event. Our 2 day event will explore the Industry 4.0 eco system. Join our world class speakers, exhibitors and customers as

Heller Industries Inc.

Used ERSA VersaFlow 40/50

Used ERSA VersaFlow 40/50

Videos

For Sale: Used ERSA VersaFlow 40/50 dual module selective soldering machine. Best in class for speed, flexibility, and reliability. Available for live or video demonstration at the Capital Equipment Exchange. details at... http://www.ce-exchange.c

Capital Equipment Exchange

Training Courses: class (1249)

IPC-A-610 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-A-610 Specialist (CIS)

The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies

Blackfox Training Institute, LLC

IPC-7711/7721 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: class (409)

Cleaning for Reliability - Overcoming Challenges for Class III Assemblies - Online Webinar

Events Calendar | Thu Jul 26 00:00:00 EDT 2018 - Thu Jul 26 00:00:00 EDT 2018 | ,

Cleaning for Reliability - Overcoming Challenges for Class III Assemblies - Online Webinar

ZESTRON Americas

Defluxing Advanced Packages

Events Calendar | Thu Aug 27 00:00:00 EDT 2020 - Thu Aug 27 00:00:00 EDT 2020 | ,

Defluxing Advanced Packages

ZESTRON Americas

Career Center - Resumes: class (51)

Vinoth Kumar

Career Center | Chennai, Tamilnadu India | Engineering,Maintenance,Purchasing,Quality Control,Sales/Marketing,Technical Support

I have two year experience in debugging and SMT,THT, and BGA reworking at Avalon technology..

SMT Prosess/Production Engineer

Career Center | Delhi, India | Engineering,Production,Quality Control

Programming, Operation, Maintenance,Troubleshooting of SMT machines. Programming of cyber optics/saki(AOI) Programmingn of pcb seperater Temperature profiling (Making & Soldering) Testing,Troubleshooting of microcontroller based PCAs

Express Newsletter: class (135)

SMTnet Express - July 28, 2016

SMTnet Express, July 28, 2016, Subscribers: 25,879, Companies: 14,883, Users: 40,795 Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware Mike Bixenman, DBA - Kyzen Corporation

Partner Websites: class (6253)

IPC Class - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2176&OB=ASC.html

IPC Class - PCB Libraries Forum   Forum Home > PCB Footprint Expert > Questions & Answers    New Posts    FAQ    Search    Events    Register    Login IPC Class  Post Reply Author Message

PCB Libraries, Inc.

Optimum Class VI alkatrészek - Nordson EFD

">ASYMTEK Products | https://www.nordson.com/hu-HU/divisions/efd/products/syringe-barrels-and-cartridges/optimum-class-vi-dispensing-components

Optimum Class VI alkatrészek Nordson EFD Nordson EFD Csak részleg vagy főosztály Nordson egésze Termékek Kiegészítők Állatgyógyászati adagolófecskendők Automata adagolórendszerek Komponensek

">ASYMTEK Products


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