Industry Directory | Manufacturer
Heller Thermal Systems India location featuring reflow soldering ovens and pressure curing ovens.
Industry Directory | Manufacturer
Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds. Master Bond specializes in epoxies, silicones and uv curable polymer systems.
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Electronics Forum | Tue May 13 08:59:13 EDT 2014 | gazelle
Hello davef - could it be you are confusing low thermal emf (Seebeck coefficient) with low temperature solder ? I am looking after solder wire and paste with low Seebeck coefficient - cadmium based alloy was OK but banned in europe due to RoHs direct
Electronics Forum | Fri Jun 06 06:11:18 EDT 2014 | paulg
I have a large monoblock ceramic filter on a PTFE based pcb material. The filter has a metal casing soldered onto the ceramic filter. I am concerned that if the heating rate is to rapid, then thermal shock / differential expansion could cause the fil
Used SMT Equipment | Screen Printers
Ekra Type model – X5 Serial-Number – X5 01089 Alignment Repeatability - +12.5 µm@6sigma Printing speed - 9mm/sec to 200mm/sec Printing pressure – 0kg to 26kg Frame size – 736mm*736mm*38mm Pr
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Industry News | 2019-12-19 17:48:47.0
IPC announces the release of IPC-8921, Requirements for Woven and Knitted Electronics Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires.
Parts & Supplies | Pick and Place/Feeders
JUKI E7126706RAA STOPPER 444R ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI E7126706RAC SUTOPPER 44FR-OP www.fujintai.com JUKI E7150700000 SEPARATE TIMING BELT FUJINTAI TECHNOLOGY CO.,LTD JUKI E71507160A0 FEEDER TYPE 2 www.fujintai.com JUKI E715171600
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Parts & Supplies | Pick and Place/Feeders
JUKI FX-1(FX-1R) ELBOW UNION PN:PJ304085104 Supply all juki spare parts at a lower price. pls contact us if you have interested. JUKI E6947705000 REEL PRESSURE BASE 12/16 SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E6948705000 SHUTTER COVER 12/16 ww
Technical Library | 2008-02-04 12:13:38.0
Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.
Technical Library | 2008-11-13 00:06:32.0
The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB material. Thus it is necessary to have low CTE printed circuit boards in order to keep solder joint intact with such low CTE packages. There are currently several materials available in the market to address thermal and CTE challenges but each material has its own advantages and limitations...
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Career Center | Los Gatos, California | Management,Sales/Marketing
Seasoned sales professional skilled in both direct sales and sales management. Recognized for polished communication, negotiation, and problem-solving skills, Excelled in positions where a combination of direct sales and channel sales force developm
Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
thermal expansion (CTE) mismatch between the package and the PCB [20, 21]. The CTE of the PCB was measured using a thermomechanical analyzer (TMA) and the composite coefficients of thermal expansion of the 192CABGA and 84CTBGA packages were measured using
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
. The QFN component coefficients of thermal expansion (CTE) were measured using Digital Image Correlation (DIC), and the CTE of each PCB was measured using a thermomechanical analyzer (TMA
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