Industry Directory: component terminations for rf applications (1)

TECATE TRANSFORMERS

Industry Directory | Manufacturer / Other

Tecate Transformers have proudly engineered, manufactured, and distributed all the finest transformers, Inductors, Toroids, Harness, Air Coils, and Electrical Boards. We provide electronic assembly and manufacturing services.

New SMT Equipment: component terminations for rf applications (470)

Honeywell	FTA-T-17 Digital output (relay) FTA for AK5/6 applications (4 channels)

Honeywell FTA-T-17 Digital output (relay) FTA for AK5/6 applications (4 channels)

New Equipment | Industrial Automation

      Cambia Automation Limited       Contact  Freely Manager: Trixie Email: sales@cambia.cn company website:www.cambiaplc.com Mobile: +86 13599507613 Skype: +86 13599507613 (Whatsapp/ Wechat) You Want to Know Warranty: one year Conditio

Cambia Automation Limited

VIPA SSN-BG89A Ethernet Card for Simatic S5

VIPA SSN-BG89A Ethernet Card for Simatic S5

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: component terminations for rf applications (5)

Stencil Printing for 0201 Applications

Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake

Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed

SMT Design Issues for 2225 Capacitors in High Power RF

Electronics Forum | Mon Aug 08 16:14:36 EDT 2011 | wmburke

We are building a plasma diagnostic to monitor MHD phenomena in tokamak. As part of the development, we need high-voltage, high-power RF capacitors to tune and match an inductive load. This application is similar to a small induction heater, with t

Used SMT Equipment: component terminations for rf applications (3)

Stanford Research CG635

Stanford Research CG635

Used SMT Equipment | In-Circuit Testers

Stanford Research CG635The CG635 generates extremely stable square wave clocks between 1 Hz and 2.05 GHz. The instrument's high frequency resolution, low jitter, fast transition times, and flexible output levels make it ideal for use in the developme

Test Equipment Connection

Stanford Research CG635

Stanford Research CG635

Used SMT Equipment | In-Circuit Testers

Stanford Research CG635 The CG635 generates extremely stable square wave clocks between 1 Hz and 2.05 GHz. The instrument's high frequency resolution, low jitter, fast transition times, and flexible output levels make it ideal for use in the deve

Test Equipment Connection

Industry News: component terminations for rf applications (82)

No Solder Required for Press-fit D-subs

Industry News | 2003-04-08 10:28:06.0

A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Technical Library: component terminations for rf applications (11)

SMT Component Reliability for RF Applications

Technical Library | 2019-05-31 14:19:24.0

ACI Technologies (ACI) characterized the reliability of surface mount RF components. The RF frequency band of interest was the X band (10.7 to 11.7GHz). A two pronged test for reliability of circuit card assemblies (CCA) was designed for both extreme thermal cycling and vibration. The rapid thermal cycling and extreme vibration testing simulates the total stress encountered by the assembly over the life of the product but accomplishes it in a relatively short period of time. In order to perform the reliability testing, a test vehicle consisting of a printed circuit board with test structures and components, was designed, fabricated, and assembled at ACI.

ACI Technologies, Inc.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

Technical Library | 2023-09-18 14:10:01.0

As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.

NASA Office Of Safety And Mission Assurance

Training Courses: component terminations for rf applications (1)

IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies Training and Certification Program

Training Courses | ON DEMAND | | IPC J-STD-001 Trainer (CIT)

The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.

PIEK International Education Centre

Events Calendar: component terminations for rf applications (1)

Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?

Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,

Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?

Surface Mount Technology Association (SMTA)

Express Newsletter: component terminations for rf applications (909)

SMTnet Express - October 23, 2014

SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company

Flexible Termination - Reliability in Stringent Environments

Flexible Termination - Reliability in Stringent Environments News   Forums   SMT Equipment   Company Directory Calendar   Career Center   Advertising   About   FREE Company Listing! Flexible Termination - Reliability in Stringent Environments

Partner Websites: component terminations for rf applications (118)

Gold Removal on Bottom Only SMT RF Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components

Gold Removal on Bottom Only SMT RF Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating | No

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-research-evaluates-the-effects-of-rf-plasma-processing-prior-to-conformal-coating

." The evaluation was done in three stages, with objectives for each below: Stage 1: To test the effect of argon RF plasma process parameters on discrete components in order to mitigate concern of the effect of vacuum pressure and plasma power on electric functionality. Stage 2

ASYMTEK Products | Nordson Electronics Solutions


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