New Equipment | Education/Training
Bare Board Inspection Training This 3-day, lectured course utilizes the images in the IPC-A-600 document to provide visual accept/reject criteria examples for all three classes of bare board fabrication and inspection. The IPC-A-600, “The Acce
New Equipment | Education/Training
Bare Board Inspection Training This 3-day, lectured course utilizes the images in the IPC-A-600 document to provide visual accept/reject criteria examples for all three classes of bare board fabrication and inspection. The IPC-A-600, “The Acce
A range of machinery health modules for predictive maintenance and general industrial condition monitoring. Specifically targetted for increasing need to monitor in process and plant whilst facing decreasing staffing and lowering skill standards. DrX
IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2
reflowsystems.com manufactures and distributes three series of ovens to offer a perfect fit in size and price for every production need: 1) CORA 450 and 250 are combining not only COnvection and RAdiation to guarantee stressfree soldering of BGAs eve
New Equipment | Soldering Robots
Model R50CD (Computer) Heating zones Upper 5/lower 5 Length of heating zone 1730mm PCB width Chain 300mm, mesh 350mm Conveyor chain width range 50-300mm PCB direction L→R or (R→L) Chain fixing Front fix(back fix is optional) Conveyor hei
Description Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fixtures and other specialty soldering fixtures.
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Instantly and accurately detect process changes due to variations in oven loading, convection levels, conveyor speed or zone set points errors. The SolderStar DeltaProbe is periodically passed through the reflow process to allow rapid verification of