Precision casting foundary who has achieved a reputation as an aggressive leader in the production of investment casting, permanent mold casting and rapid prototype casting.
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
New Equipment | Coating Equipment
ASCEN PCB coating equipment use to provide a is a high-performance film as a protective layer for PCB from the environment,this conformal coating‘s purpose is to protect electronic circuits from harsh environments that may contain hig
Electronics Forum | Thu Apr 12 09:12:19 EDT 2018 | san_jeev490
Hello, currently I am being getting solder pot contamination test form my supplier and results found okay to except. during the audit question was raised on historical data analysis, I request can some help me by sharing excel graphical template to
Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel
Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n
Industry News | 2011-08-18 21:23:09.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Industry News | 2011-08-18 21:24:08.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
link: https://www.ascen.ltd/Products/conformal_coating_equipment/ ASCEN designs and manufacturers pcb conformal coating machine for the printed circuit board industry.surface conformal coating equipment include selective coating,brush coating, aeroso
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework SMTnet Express December 20, 2012, Subscribers: 26064, Members: Companies: 9072, Users: 34080 Advantages of Bismuth-based Alloys for Low Temperature Pb
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
manufacturing process and reduce the degree of pot contamination during PTH rework. However, the push to replace SAC305/405 alloy with an alternative Pb-free alloy within the wave soldering process could easily be justified from a financial perspective in
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/barrels/injection-barrels
barrel for a longer period of time Improved productivity One piece barrel construction, for barrels up to 6100 mm (240''), thus eliminating seams causing degradation or contamination of the process Xaloy X-800®
