Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2016-09-08 13:23:38.0
KYZEN, a global leader in environmentally responsible cleaning technologies, introduces a new line of solvent blends designed for high reliability in a wide spectrum of industrial cleaning applications. With critical focus on meeting increasing regulations and high quality output, KYZEN’s new solvents have affectionately been dubbed “green and clean,” by many in the industry.
Industry News | 2013-11-08 19:18:10.0
Gen3 Systems will exhibit with its distributor, Stannol, in Hall A4, Stand 470 at the productronica International Trade Fair.
Industry News | 2017-08-06 19:43:49.0
Conecsus, LLC, announced today that they are partnering with Amerway Inc., and COBAR Balver Zinn Solder Products, two leading global solder manufacturers, to provide a ‘cradle to grave’ solution for electronics manufacturers. Conecsus, LLC is an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues, as well as Tin, Lead, Antimony, Silver, Gold, and other metals from a variety of manufacturing industries. Conecsus converts these wastes into usable metal products, paying cash to the customer.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2016-08-31 18:26:46.0
Gen3 Systems Limited will exhibit in Booth #219 with Ascentech, LLC at SMTA International, scheduled to take place Sept. 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2024-03-11 18:00:52.0
Gen3 is proud to announce its participation in the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. At booth 3934, GEN3 will be exhibiting alongside Horizon Sales, presenting a lineup of advanced technologies aimed at enhancing the efficiency and reliability of circuit assembly processes.
Industry News | 2011-04-06 13:13:52.0
Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
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