Industry News | 2011-05-06 21:39:30.0
Kyzen announces that Phil Zhang, its China Sales Manager, will present twice during the upcoming SMTA China East conference, which is being held in conjunction with NEPCON China 2011.
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
The Industry Requirement for 2D and 3D Inspection Technology in a Single AOI Platform SMTnet Express November 21, 2012, Subscribers: 26000, Members: Companies: 9045, Users: 33968 The Industry Requirement for 2D and 3D Inspection Technology in a
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
., solder wicking control, bump height / coplanarity control, and bump void control. It’s crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements
| https://www.feedersupplier.com/sale-13018909-smt-koh-young-ky8030-3-spi-inspection-machine.html
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