Industry Directory: copper foil crack (6)

Oak Mitsui Inc.

Oak Mitsui Inc.

Industry Directory | Manufacturer of Components

Oak-Mitsui specializes in the development and production of world class performance foils, Aluminum Bonded Copper, and FaradFlex� Buried Capacitance� materials.

Lamar Uk Limited

Lamar Uk Limited

Industry Directory | Distributor

Suppliers to the PCB Industry with a huge range of products including copper clad laminates, drill boards and consumables.

New SMT Equipment: copper foil crack (63)

DSP 825HF No-Clean Solder Paste Halogen Free Lead Free

DSP 825HF No-Clean Solder Paste Halogen Free Lead Free

New Equipment | Solder Materials

DSP 825HF is a lead-free, no clean, halogen-free solder paste designed specifically for a wide range of lead-free alloys. It provides an x-treme fluxing activity level with excellent wetting on copper OSP-coatings. Wide reflow process windows combine

Qualitek International, Inc.

EMI/RFI Shielding Laminates

EMI/RFI Shielding Laminates

New Equipment | Materials

To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)

ORION Industries

Electronics Forum: copper foil crack (131)

Re: Plating crack

Electronics Forum | Wed Sep 27 19:37:32 EDT 2000 | Dave F

Wolfgang is correct. Copper plating thickness of the via barrel walls is a key question you need to answer to troubleshoot this. Tenting is a red herring.

Re: Plating crack

Electronics Forum | Wed Sep 27 17:24:08 EDT 2000 | Wolfgang Busko

Ashok: Plating thickness and ductility of the copper are things to look for. If it�s a crack where two layers are pressed together one possible cause could be bad process parameters while pressing these layers together at the PCB shop with the resul

Industry News: copper foil crack (51)

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

Gould to Consolidate U.S. Copper Foil Manufacturing

Industry News | 2003-02-21 08:53:41.0

Gould Electronics Inc. said that all of its U.S. copper foil manufacturing will be consolidated at the company's Chandler, AZ facility by the end of the third quarter of 2003.

SMTnet

Parts & Supplies: copper foil crack (6)

Fuji K3031M K3031T

Fuji K3031M K3031T

Parts & Supplies | Assembly Accessories

CNSMT K3031M K3031T DAPHNE EPONEX NO.2 2.5 / 16KKG CNSMT K3031M K3031T DAPHNE EPONEX NO.2 2.5 / 16KKG SFN0AS JUKI Stick feeder for Surface Mounted Technology Mach SFN1AS JUKI Stick feeder for JUKI KE-2050 KE-2060 KE-2070 KE SFN2AS JUKI Stick

CNSMT CO.LTD

Fuji K3031M K3031T

Fuji K3031M K3031T

Parts & Supplies | Assembly Accessories

CNSMT K3031M K3031T DAPHNE EPONEX NO.2 2.5 / 16KKG CNSMT K3031M K3031T DAPHNE EPONEX NO.2 2.5 / 16KKG SFN0AS JUKI Stick feeder for Surface Mounted Technology Mach SFN1AS JUKI Stick feeder for JUKI KE-2050 KE-2060 KE-2070 KE SFN2AS JUKI Stick

CNSMT CO.LTD

Technical Library: copper foil crack (210)

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Extending Soldering Iron Tip Life

Technical Library | 1999-05-09 13:05:12.0

This Technical Note discusses the construction of solder tips, the various failure modes associated with tip plating (cracking, wear, corrosion, and dewetting), how to diagnose those failure modes, and specific practices that can be taken to minimize or eliminate each one.

Metcal

Videos: copper foil crack (48)

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

Videos

Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferr

Clariant Cargo & Device Protection

The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring boards using an internationally-recognized program.

The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring boards using an internationally-recognized program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.

Training Courses: copper foil crack (7)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC-A-600 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-600 Specialist (CIS)

The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.

ACI Technologies, Inc.

Events Calendar: copper foil crack (40)

IPC-A-600 Operator Certification

Events Calendar | Wed Jun 03 08:00:00 EDT 2015 - Fri Jun 05 16:00:00 EDT 2015 | Cleveland, Ohio USA

IPC-A-600 Operator Certification

BEST Inc.

IPC-A-600 Operator Certification

Events Calendar | Wed Jul 15 00:00:00 EDT 2015 - Fri Jul 17 00:00:00 EDT 2015 | Huntsville, Alabama USA

IPC-A-600 Operator Certification

BEST Inc.

Career Center - Resumes: copper foil crack (1)

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Express Newsletter: copper foil crack (174)

SMTnet Express - August 16, 2018

SMTnet Express, August 16, 2018, Subscribers: 31,259, Companies: 11,015, Users: 25,092 Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi; JX

SMTnet Express - November 22, 2017

SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper

Partner Websites: copper foil crack (26)

970639 Orion 4 sheets

ORION Industries | http://orionindustries.com/pdfs/shielding.pdf

970639 Orion 4 sheets ORION INDUSTRIES INCORPORATED PCB-Shields A copper foil/polyester laminate was selectively die cut removing the copper foil from all edges of the piece

ORION Industries

Application Notes

Nordson ASYMTEK | https://www.nordson.com/en/divisions/sonoscan/support/application-notes

Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA

Nordson ASYMTEK


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Online IPC Training & Certification

ONLINE IPC Training & Certification
https://pages.zestron.com/zestron-analytical-support-services

Orange Sticks, Wiring Aids & Probes for Soldering & Desoldering.
Fourier Transform Infrared Spectroscopy

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