Industry News: copper foil crack (Page 1 of 8)

Gould to Consolidate U.S. Copper Foil Manufacturing

Industry News | 2003-02-21 08:53:41.0

Gould Electronics Inc. said that all of its U.S. copper foil manufacturing will be consolidated at the company's Chandler, AZ facility by the end of the third quarter of 2003.

SMTnet

Nippon Mining Holdings to Increase Production Capacity for Rolled Copper Foil

Industry News | 2003-03-12 09:03:48.0

Demand for the material, used in PCBs, is increasing because of folding mobile phones and other devices

SMTnet

Best Technical Conference Papers at IPC APEX EXPO 2024 Selected

Industry News | 2024-03-11 14:58:44.0

New this year, student scholarship awarded by IPC Education Foundation

Association Connecting Electronics Industries (IPC)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

Best Technical Papers at IPC APEX EXPO 2023 Selected

Industry News | 2023-01-16 07:35:11.0

The best technical conference papers of IPC APEX EXPO 2023 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 24.

Association Connecting Electronics Industries (IPC)

SMTA China Presents Nine Best-Paper/Presentation Awards and Two Best Exhibit Awards at SMTA China East 2014 Conference/NEPCON China 2014

Industry News | 2014-05-12 16:06:39.0

SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

IPC Announces Agenda for Component Technology Conference September Event to Target 3-D and Other Interconnection Solutions

Industry News | 2013-06-20 19:24:42.0

IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.

Association Connecting Electronics Industries (IPC)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

Clariant introduces innovative halogen- and cobalt dichloride-free Type 2 Non-reversible Humidity Indicator Cards to ensure integrity of moisture sensitive electronic components

Industry News | 2019-10-22 12:34:34.0

Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferred by IPC/JEDEC standard J-STD-033D.

Clariant Cargo & Device Protection

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