Electronics Forum | Fri Apr 16 11:03:35 EDT 2004 | davef
Your copper corrosion is not good. It indicates that you have not done a good job in cleaning. [We assume this is a medium green color, not unlike the color of the solder mask on your board, that is almost like a translucent lacquer; rather than th
Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2017-08-06 19:39:48.0
The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2019-02-13 13:45:11.0
Development of information and telecommunications network is outstanding in recent years, and it is required for the related equipment such as communication base stations, servers and routers, to process huge amount of data in no time. As an electrical signal becomes faster and faster, how to prevent signal delay by transmission loss is a big issue for Printed Circuit Boards (PCB) loaded on such equipments. There are two main factors as the cause of transmission loss; dielectric loss and conductor loss. To decrease the dielectric loss, materials having low dielectric constant and low loss tangent have been developed. On the other hand, reducing the surface roughness of the copper foil itself to be used or minimizing the surface roughness by modifying surface treatment process of the conductor patterns before lamination is considered to be effective in order to decrease the conductor loss. However, there is a possibility that reduction in the surface roughness of the conductor patterns will lead to the decrease in adhesion of conductor patterns to dielectric resin and result in the deterioration of reliability of PCB itself. In this paper, we will show the evaluation results of adhesion performance and electrical properties using certain type of dielectric material for high frequency PCB, several types of copper foil and several surface treatment processes of the conductor patterns. Moreover, we will indicate a technique from the aspect of surface treatment process in order to ensure reliability and, at the same time, to prevent signal delay at the signal frequency over 20 GHz.
Events Calendar | Tue Mar 07 00:00:00 EST 2017 - Thu Mar 09 00:00:00 EST 2017 | Fountain Hills, Arizona USA
13th International Conference and Exhibition on Device Packaging
International Microelectronics Assembly and Packaging Society (IMAPS)
Developing a Reliable Lead-free SMT Assembly Process Developing a Reliable Lead-free SMT Assembly Process What are the key process requirements to achieve reliable lead-free SMT assembly? Lead-free SMT can be achieved reliably if several
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
. Optical image showing the word IBEX created as a mosaic of random thicknesses of silver and copper foils (top); X ray transmission image showing that it is not possible to distinguish between the foils using absorption contrast alone (middle
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
concentration in the solder the rate of dissolution decreases because of the concentration gradient reduction. Thus, solders with 0.7% Cu remove less copper from the plating layer than solders with 0.5% Cu. Therefore, based on this, the Cu dissolution rates of
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