Industry Directory: corner bga (2)

Tianjin Reains Technologies Co., Ltd

Industry Directory | Adhesives / Dispensing

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

ALLTEMATED, INC.

ALLTEMATED, INC.

Industry Directory | Manufacturer of Assembly Material

Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.

New SMT Equipment: corner bga (17)

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

New Equipment | Dispensing

The next level of refinement, the Quantum™ Q-6800 Series is Nordson ASYMTEK’s latest high-performance, large-format dispensing platform. The Quantum platform has the same large dispense area as Axiom with a laser height sensor (LHS) while new sophis

Nordson ASYMTEK

DJ-9000 DispenseJet Jet Technology

DJ-9000 DispenseJet Jet Technology

New Equipment | Dispensing

Jetting is the best way to dispense many fluids quickly and accurately. The DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts. Speed, Flexibility, Process Control, Experience Based on

Nordson ASYMTEK

Electronics Forum: corner bga (264)

bga warp

Electronics Forum | Wed Sep 11 16:57:04 EDT 2002 | bigwop

I've seen this problem caused by the cool down. > On a 7 zone oven I made a profile to peak at zone > 5 to give some semblance of control to the cool > down. The component can develope a big delta T, > because of the difference of materials Che

Re: bga

Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY

I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". these machines dont even offer bga selections. These mac

Used SMT Equipment: corner bga (3)

Universal Instruments Universal AdVantis AC-30L SMT Placement

Universal Instruments Universal AdVantis AC-30L SMT Placement

Used SMT Equipment | Chipshooters / Chip Mounters

30 intelligent spindle assemblies      -> All vision processing is performed “on the fly” to maximize throughput.      -> Continuous updates of X, Y, and Z-height pickup and placement locations ● On-The-Head Cameras      -> narrow field of view c

Capital Equipment Exchange

Panasonic high speed chip mounter NPM

Panasonic high speed chip mounter NPM

Used SMT Equipment | SMT Equipment

Product Name:Panasoinc  high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment

Dongguan Kingsun Technology Co.,Ltd.

Industry News: corner bga (11)

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: corner bga (3)

JOT Optical BGA Rework Station FG-

JOT Optical BGA Rework Station FG-

Parts & Supplies | Repair/Rework

Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking

Goodluck Electronic Equipment Co.,Ltd

Cyberoptics camera 8008632 supply&repair

Cyberoptics camera 8008632 supply&repair

Parts & Supplies | Pick and Place/Feeders

CYBEROPTICS laser/CYBEROPTICS camera:JUKI laser(570/620/730/740/750/760/2010/2020/2030/2040/2050/2060/2070/2080/KJ-01/KJ-02//FX-1/FX-2/FX-3/3020R/JX-100 laser unit),YAMAHA laser,SAMSUNG laser,TENRYU laser,PHILIPS(ASSEMBLEON) FCM PPU laser,Autotronik

FUJINTAI TECHNOLOGY CO.,LIMITED

Technical Library: corner bga (88)

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2020-02-26 23:24:02.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

Nordson ASYMTEK

Rework Challenges for Smart Phones and Tablets

Technical Library | 2015-04-23 18:48:18.0

Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.

Metcal

Videos: corner bga (6)

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

Videos

Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com

Nordson ASYMTEK

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Videos

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com

Nordson ASYMTEK

Events Calendar: corner bga (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: corner bga (1)

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: corner bga (447)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall

Partner Websites: corner bga (80)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

/degradation. Figure 22 (top image) illustrates two BGA corner/outer row solder joints that failed in the typical location at the component/solder joint interface. One of these solder joints (magnified lower image) has a void less than the 25% maximum

Heller Industries Inc.

Underfill - ITW EAE

| https://www.itweae.com/applications/dispensing/underfill

Stencil Printing Dispensing Conductive Adhesives Dam & Fill Encapsulation Edge/Corner Bonding Flux Applications RTV/Gasketing Applications Solder Paste Surface Mount Adhesives Thermal Interface Materials UV Selective Coating Underfill Cleaning Batch


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