Industry News | 2010-05-29 18:05:27.0
Christopher Associates Inc. today introduced a powerful new yield improvement tool for the solder paste printing process. SPC+ Software, developed by Koh Young Technology, is a high-functionality statistical process control (SPC) package that can be run on the system or offline. The new software is included free of charge on all new Koh Young equipment.
Industry News | 2011-06-24 18:52:10.0
Vicor Corporation, recently evaluated DEK’s award-winning Nano-ProTek stencil nano coating and has reported excellent results. On a densely populated board with multiple 0402, 0201, BGA and micro-BGA components, Nano-ProTek helped improve CpK and yield.
Industry News | 2012-12-03 16:09:15.0
LPKF Laser & Electronics will present the webinar Stencil Aperture Size and Its Impact on the Printing Process Thursday, December 6, 2012 at 11 a.m. PST. The webinar examines the relationship between stencil aperture size and solder paste volume and how the stencil manufacturing process can influence both.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Industry News | 2010-08-17 14:51:15.0
Enjoying the materials innovation success it has realized with its first DEK Galaxy system, Cary, North Carolina-based LORD Corporation recently expanded its development capacity with the addition of a second Galaxy equipped with DEK’s new Wafer Transport Solution.
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