Industry Directory: crack and joint (1)

Shuttle Star Technology Co., Ltd.

Industry Directory | Manufacturer

Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.

New SMT Equipment: crack and joint (29)

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Education/Training

This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac

BEST Inc.

Electronics Forum: crack and joint (433)

Solder joint crack

Electronics Forum | Fri May 31 05:54:09 EDT 2019 | dhanish

What are the common cause for solder joint crack after the pcba go through Temperature cycling test ?We have seen failure on solder joint for the memory part.

Solder joint crack

Electronics Forum | Tue Jun 25 09:45:39 EDT 2019 | edhare

See also ... https://www.semlab.com/solder-joint-failure-modes/

Industry News: crack and joint (475)

Nashua and Parlex Announce Strategic Development Agreement

Industry News | 2003-03-11 08:28:59.0

To cooperate in the development of flexible circuit technology incorporating proprietary printing and plating technologies.

SMTnet

Proposed Merger of Beyonics and Flairis Announced

Industry News | 2003-03-25 08:31:07.0

On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.

SMTnet

Parts & Supplies: crack and joint (14)

Fuji GFPN1150  xp142 and xp143 filter

Fuji GFPN1150 xp142 and xp143 filter

Parts & Supplies | Assembly Accessories

GFPN1150  xp142 and xp143 filter WPQ0784 HOLDER W1008T WASHER TOOTHED CONIGAL H4118T BEARING WPQ0760 COLLAR WPQ0771 NUT WPQ0791 RETAINER BEARING H42726 BEARING SPHERICAL WPQ0850 PIN WPQ0811 ROD JOINT H2025A PIN SNAP K5203A SCREW TRUS

Qinyi Electronics Co.,Ltd

Samsung Sm Type 8X2mm Feeder for Pick and Place Machine

Samsung Sm Type 8X2mm Feeder for Pick and Place Machine

Parts & Supplies | Assembly Accessories

Samsung available Feeder in stock: Samsung CP40/CP45/CP60 8*2mm Feeder Samsung CP40/CP45/CP60 8*4mm Feeder SAMSUNG CP40/CP45/CP60 8MM FEEDER Samsung CP40/CP45/CP60 12mm Feeder Samsung CP40/CP45/CP60 16mm Feeder Samsung CP40/CP45/CP60 24mm Feede

KingFei SMT Tech

Technical Library: crack and joint (45)

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2023-01-17 17:27:13.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)

Heller Industries Inc.

Underfill Dispensing For Aerospace Military And Defense

Technical Library | 2023-08-16 18:20:44.0

One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.

GPD Global

Videos: crack and joint (64)

circle blade PCB cutting machine|PCB separator|PCB cutting machine

circle blade PCB cutting machine|PCB separator|PCB cutting machine

Videos

http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,

ASCEN Technology

PCB Depaneling Machinery |PCB separator|PCB depaneling machine

PCB Depaneling Machinery |PCB separator|PCB depaneling machine

Videos

http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,

ASCEN Technology

Training Courses: crack and joint (3)

Workmanship Standards and Instruction for the Soldering & Rework of Through-Hole and Surface Mount Components

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Events Calendar: crack and joint (10)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference and Exhibition

Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands

Electronics in Harsh Environments Conference and Exhibition

Surface Mount Technology Association (SMTA)

Express Newsletter: crack and joint (251)

SMTnet Express - October 28, 2021

SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock

SMTnet Express - February 6, 2020

SMTnet Express, February 6, 2020, Subscribers: 33,800, Companies: 10,971, Users: 25,576 Accurately Capturing System-Level Failure of Solder Joints Credits: DfR Solutions Consortium Projects - Thermal Cycling Reliability Consortium projects allow

Partner Websites: crack and joint (3775)

DEK joint and Valve of 602286 | QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/part-of-602286-joint-and-valve-for-dek-225897?page=18&order=list_price+asc

DEK joint and Valve of 602286 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products Joint and Valve for DEK Public Pricelist Public Pricelist

Qinyi Electronics Co.,Ltd

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

solder. When the voiding is extremely large and occupies a position in the potential fatigue crack path, the reduction in characteristic lifetime caused by void-assisted fracture of the solder joint is between 25 and 50%. This relationship between solder

Heller 公司


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