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(possibly from vibration)? Might that cause stress on the parts and possibly crack them? I expect the leads will bend better than a component body would against the solder, but I could be wrong
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trimming-heels-under-the-component-body_topic12_post23.html
(possibly from vibration)? Might that cause stress on the parts and possibly crack them? I expect the leads will bend better than a component body would against the solder, but I could be wrong
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-flow-near-through-hole-component-body
. It does not appear that it is touching the IC body, but can... Question: We have a through-hole integrated circuit (IC) component that has good wetting when it goes through the wave soldering machine, and the solder climbs pretty far up the lead
| https://www.eptac.com/ask/solder-flow-near-through-hole-component-body/
. It does not appear that it is touching the IC body, but can you tell me what is the IPC requirement for this process? Answer: Based upon the requirements of IPC-A-610
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
glass bodied components. The hot solder touching the glass body will cause a shock to the glass, potential causing the glass to crack or craze, which would cause a latent failure of the component
| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/
glass bodied components. The hot solder touching the glass body will cause a shock to the glass, potential causing the glass to crack or craze, which would cause a latent failure of the component
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Why do footprint names indicate transistor vs IC? - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Why do footprint names indicate transistor vs IC
| https://www.eptac.com/faqs/ask-helena-leo/ask/bridging-two-adjacent-pins-on-an-ic
Bridging Two Adjacent Pins on an IC - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor