New Equipment | Selective Soldering
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
New Equipment | Selective Soldering
Enhanced, entry-level, single point selective soldering system With all the proven features of the Jade MKII, the Jade MKIV sets even higher standards of performance. Designed to meet the needs of the small/medium batch manufacturer who requires hi
Electronics Forum | Mon Aug 01 06:59:02 EDT 2005 | Joseph
Dear all, We observed visible micro crack at top side of solder fillet during lead free wave solder process. We did not see any visible micro crack at bottom side, and it always located at joints of transformer. Any input be much appreciated. Best
Electronics Forum | Thu Jul 18 04:42:32 EDT 2013 | ericrr
Thanks for that, sorry Im late setting (set by someone else) Speedline Bravo Top 1st chamber, 2nd, 3rd, 4th. 170° (c), 180°, 190°, 270°. Bottom 170°, 180°, 180°, 260° chain speed 27cm/second.
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti
Used SMT Equipment | AOI / Automated Optical Inspection
(2) Orbotech Automated Optical Inspections Machines For Sale Machine were just taken out of Military OEM facility in good working condition Both machines are being sold together at discounted price See attached pictures and information below
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2022-10-12 08:07:17.0
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the circuit board assembly line. The basic principle of AOI is to judge whether the object to be tested meets the standard by comparing whether there is a large difference between the object to be tested and the standard image by using image technology. AOI emits a 4-color light source to the PCBA board, which is automatically scanned by an industrial camera for catastrophic failures, such as missing components or quality defects. Therefore, the quality of AOI depends on the image imaging ability, algorithm parsing ability and image discrimination technology. I.C.T AOI has done well in these aspects.
Parts & Supplies | Pick and Place/Feeders
JUKI 40065161 HEAD FAN RELAY CABLE ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI 40065162 OCC FAN CABLE ASM www.fujintai.com JUKI 40065168 Y FRAME END FAN CABLE A ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI 40065169 Y FRAME END FAN CABLE B ASM www.fujintai.com
CARRY PWB E86177210A0(1).jpg)
Parts & Supplies | Pick and Place/Feeders
Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0 JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effect of Reflow Profile on SnPb and SnAgCu Solder
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4996
Investigation of the Influence of Voids n the Reliability of Solder Joints by Finite Element Method 中文 MEMBERS LOGIN Membership Become a Member
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/selective-vs-manual-soldering
Soldering Selective vs Wave Soldering AOI Solder Joint inspection X-Ray Solder Joint inspection Back To Top Nordson SELECT supplies selective soldering systems that are supported by a global service network
