Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
Quote and lead time Formosa SOLDER,PASTE,SN96.5/AG3/CU.5,89%,20/38um.
Industry Directory | Manufacturer
We are manufacturer of key products for semiconductor back end process and interconnect materials. Our main products:solder balls, Bonding wire (Au, Ag, Cu, Pd-Cu),sputtering target & EVM materials.
New Equipment | Solder Paste Stencils
Product material: stainless steel (internal) + steel plate baking paint Storage quantity: 36 cans of tin paste Product weight: 13kg Product size: 495 * 750 * 95mm Application: SMT workshop solder paste storage control, first in, first out
Type no. K-MA8835 Heating parameters Number of heating zones On 8 August Length of heating zone 2850mm Heating mode Hot air Number of cooling zones 1 Send some parameters
Electronics Forum | Thu Apr 17 17:38:57 EDT 2003 | Takfire
Dave, I am not exactly sure what is driving them to believe that this is a capacitor issue. It is unfortunate, that this belief has slowed their activity in further understanding their manufacturing process. The caps are BME (Base Metal Electrode
Electronics Forum | Thu Dec 16 16:28:51 EST 2004 | Indy
Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following: 1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow so
Used SMT Equipment | Pick and Place/Feeders
Currently in production becoming available soon, two Juki 2060RL SMT Pick and Place machines, avaialble with feeders. Also becoming available: Juki FX-1R , Juki 760 and DEK 248 semi-auto solder paste screen printers AssuredTechnicalServiceLLC@Gmail
Used SMT Equipment | Pick and Place/Feeders
Currently in production becoming available soon, two Juki FX-1R SMT Pick and Place machines, avaialble with feeders. Also becoming available: Juki 2060RL, Juki 760 and DEK 248 semi-auto solder paste screen printers AssuredTechnicalServiceLLC@Gmail.c
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | CAD/CAM Systems & Software
FUJI camera IK-C40MS in stock Original ACSGP8012 CCD CAMERA(IK-C40MS) Original DBEC7731 MARK CAMERA CABLE QP351 Original K11270 IMAGE,SENSOR,CAMERA Original K1129R CCD CAMERA Original K1131D CAMERA CP6 XC-ST50FD2 Original K11323 CCD CAMERA
_11.jpg)
Parts & Supplies | AOI / Automated Optical Inspection
ZK Electronic technology suply high quality Panasonic AI parts made in China, the part number as below: N210011343AA N210129516AB STOPPER 2 KXFB02E8A03 BASE 1 KXFB02EAA02 KXFBO2EAA04 BASE 1 KXFB02EBA00 PLATE 1 KXFB02ECA01 PLATE 1 KXFB02EDA00 SH
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
One unit currently in stock for immediate shipment. Ships from California. The Chip Off Model 620 SMD Rework System features touch screen operation and programming, upper and lower spot hot air heaters, ceramic coated area heaters, HD Split-Vision
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Northern region, Mexico | Engineering
STI Electronics, Inc. is looking for a contract technical instructor located in the northern region of Mexico with 3-5 years experience in teaching IPC and electronics assembly related courses. Hands on experience in manufacturing, soldering, cabl
Career Center | New Orleans, Louisiana USA | Engineering,Technical Support
Electronic Technicians (2) If you have been searching for a beautiful place to relocate that also offers lots of activities on the weekend, this position may be your target. This client is located in New Orleans overlooking a beautiful lake that ma
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
widely adopted Sn-3.0Ag-0.5Cu solder alloys for
SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-pininpaste.php
Pin In Paste Solder Paste Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722
) density and resistance to deleterious electromigration effects. In micro Cu-pillars, SnAg solder is electroplated on top of a Cu pillar
