Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2019-04-30 18:05:43.0
Nordson ASYMTEK will exhibit its new conformal coating line and dispensing solutions at SMTconnect, Nuremberg, Germany, with SmartTec GmbH in Stand 4-101 and in the Fraunhofer IZM Future Packaging Line Stand 5-434. In addition, Gerd Schulze, key account manager, Nordson ASYMTEK, will present "Protecting Electronics -- Adhesive and potting options and practical examples" at SMTconnect Technology Days. SMTconnect is being held May 7-9, 2019.
Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards SMTnet Express November 1, 2012, Subscribers: 25762, Members: Companies: 9029, Users: 33891 Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
Imagineering, Inc. | https://www.pcbnet.com/blog/making-the-most-of-smaller-components-with-hdi-pcbs/
. To make via-in-pad possible, the PCB fabrication process includes a step to plate the via holes and fill the plated vias with epoxy before the via is then covered up with a plated copper
| https://www.eptac.com/faqs/ask-helena-leo/ask/addressing-missing-pcb-pads-from-soldering-rework
: We have a class 3 product that has some missing pads, that were removed during a rework process. If I epoxy the component in place, does the product still meet with class 3 requirements? Question
